Method and apparatus for attaching chip to a textile

• US 9,758,907 B2
• Filed: 09/22/2008
• Issued: 09/12/2017
• Est. Priority Date: 09/22/2008
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Graumann, David, Bruneau, David
• Primary Examiner(s): Vo, Peter DungBa
• Assistant Examiner(s): Kue, Kaying
• Application Number:
  US12/284,440
• Publication Number:
  US 20100071205A1
• Time in Patent Office: 3,277 Days
• Field of Search: 29825, 29729, 29740, 29742, 29749, 29760, 29762, 29832, 29850, 29748, 219549, 219529, 219542, 219551, 219211, 139425 R, 139 29, 174251
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D03D 15/67 Metal wires
• CPC Class Codes: D03J 1/00 Auxiliary apparatus combined with or associated with looms
• CPC Class Codes: D10B 2101/20 Metallic fibres
• CPC Class Codes: D10B 2201/02 Cotton
• CPC Class Codes: D10B 2211/02 Wool
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: D10B 2503/04 Floor or wall coverings; Carpets
• CPC Class Codes: D10B 2505/08 Upholstery, mattresses
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile textile substrates H05K1/038
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device

Abstract

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

Claims

1. An apparatus, comprising:

a first chip package portion of a chip package to be mounted to a textile, said first chip package portion having a connector with a first set of pads having gaps between the pads and a second set of pads to overlap the gaps of the first set of pads, in which the first chip package portion is to be mounted to a second chip package portion from an opposite side of the textile.

2. The apparatus of claim 1, in which the first and second sets of pads include more pads than are to be coupled to wires in the textile.

3. The apparatus of claim 1, in which the first chip package portion comprises a switch circuit to route selected ones of the first and second groups of pads to signal nodes.

4. The apparatus of claim 3, in which the first chip package portion comprises a supply reference detect circuit to provide supply references from the first and second groups of pads.

5. The apparatus of claim 1, in which the first set of pads are leading edge pads.

6. The apparatus of claim 1, in which the first chip package portion comprises access ports for cutting wires to be mounted to the pads.

7. The apparatus of claim 1, in which the first chip package and the second chip package portion are to be initially mechanically joined followed by a more secure joining.

8. An apparatus, comprising:

an electronic module package to mount to a textile, the electronic module package having first and second chip package portions, the first chip package portion having redundant pads for connection to wires in the textile, in which the first chip package portion and the second chip package portion mount to one another from opposite sides of the textile.

9. The apparatus of claim 8, in which the redundant pads comprise a first group of aligned pads and a second group of aligned pads, wherein at least some of the pads in the second group overlap gaps between at least some of the pads in the first group.