Optical module

• US 9,759,878 B2
• Filed: 08/25/2015
• Issued: 09/12/2017
• Est. Priority Date: 01/15/2015
• Status: Expired due to Fees

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Lee, Jong Jin
• Primary Examiner(s): Le, Uyen Chau N
• Assistant Examiner(s): CHU, CHRIS H
• Application Number:
  US14/835,134
• Publication Number:
  US 20160209609A1
• Time in Patent Office: 749 Days
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147

Abstract

An optical module includes: a circuit board having a surface in which an electronic element is mounted; an optical waveguide array in which a plurality of optical waveguides are formed; an optical element in which an optical signal that is transmitted and received from and to the optical waveguide is input and that is mounted at a side surface of the circuit board; and a connection member that connects the optical element and the electronic element, wherein a connection portion of a side surface of the circuit board in which the connection member is received has a curved shape.

Claims

1. An optical module, comprising:

a circuit board having an upper surface in which an electronic element is mounted and an edge having an opening inwardly formed;

a glass rod inserted into the opening of the circuit board;

an optical waveguide array in which a plurality of optical waveguides are formed;

an optical element in which an optical signal that is transmitted and received from and to the optical waveguide is input and that is mounted at a lower surface of the circuit board; and

a connection member that connects the optical element and the electronic element,

wherein the glass rod has a connection portion of a curved shape between the upper surface and the lower surface,

wherein the connection member is formed on the connection portion,

wherein the connection member comprises;

a transmission line, an entirety of the transmission line is curvedly formed along the curved shape of the connection portion of the glass rod; and

a wire bonding unit that connects the electronic element and the optical element at both ends of the transmission line, the wire bonding unit is directly connected to both ends of the transmission line, and

wherein the transmission line is directly formed in a pattern in the glass rod.

2. The optical module of claim 1, wherein the glass rod has a cross-sectional shape of a quarter of a circle.

3. The optical module of claim 1, wherein the optical element is formed in a direction opposite to that of the electronic element in the circuit board, and the glass rod is installed at a side surface of the circuit board.

4. The optical module 1, wherein the transmission line is directly formed in the pattern in the glass rod without separate mask production and using an infrared ray short pulse laser.