Methods and devices for fabricating and assembling printable semiconductor elements
First Claim
Patent Images
1. A method for transferring a printable semiconductor element onto a receiving surface of a non-native substrate, said method comprising:
- providing a transfer device with said printable semiconductor element removably attached thereto, wherein said transfer device comprises a three-dimensional feature in at least partial contact with said printable semiconductor element;
contacting said printable semiconductor element removably attached to said transfer device with said receiving surface of said non-native substrate; and
following said contacting of said printable semiconductor element with said receiving surface, separating said transfer device from said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, wherein said non-native substrate is non-native to said printable semiconductor element.
3 Assignments
0 Petitions
Accused Products
Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
-
Citations
41 Claims
-
1. A method for transferring a printable semiconductor element onto a receiving surface of a non-native substrate, said method comprising:
-
providing a transfer device with said printable semiconductor element removably attached thereto, wherein said transfer device comprises a three-dimensional feature in at least partial contact with said printable semiconductor element; contacting said printable semiconductor element removably attached to said transfer device with said receiving surface of said non-native substrate; and following said contacting of said printable semiconductor element with said receiving surface, separating said transfer device from said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, wherein said non-native substrate is non-native to said printable semiconductor element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
-
21. A method for transferring a plurality of printable semiconductor elements onto a receiving surface of a non-native substrate, said method comprising:
-
providing a transfer device with said plurality of printable semiconductor elements removably attached thereto, wherein said transfer device comprises a plurality of three-dimensional features, each of said plurality of three-dimensional features in at least partial contact with a corresponding semiconductor element of said plurality of printable semiconductor elements; contacting said plurality of printable semiconductor elements removably attached to said transfer device with said receiving surface of said non-native substrate; and following said contacting of said plurality of printable semiconductor elements with said receiving surface, separating said transfer device from said plurality of printable semiconductor elements, wherein said plurality of printable semiconductor elements are transferred onto said receiving surface, wherein said non-native substrate is non-native to said printable semiconductor element. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
-
Specification