Cavity substrate and method of manufacturing the same

• US 9,761,518 B2
• Filed: 02/19/2016
• Issued: 09/12/2017
• Est. Priority Date: 02/23/2015
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Sakurai, Keizou
• Primary Examiner(s): Thompson, Timothy
• Assistant Examiner(s): PIZZUTO, CHARLES M
• Application Number:
  US15/048,250
• Publication Number:
  US 20160247753A1
• Time in Patent Office: 571 Days
• Field of Search: 174255, 156250
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/462 characterized by laminating only or mainly similar double-sided circuit boards
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

A method of manufacturing a cavity substrate of the present invention includes respectively laminating second and third substrates on upper and lower surfaces of a first substrate having an opening and having an external dimension larger than an external dimension of each of the second and third substrates to ensure that an end portion of the first substrate protrudes a first length from the second and third substrates, and cutting the end portion of the first substrate protruding from each of the second and third substrates to a second length smaller than the first length.

Claims

1. A cavity substrate comprising:

a first substrate having an opening; and

second and third substrates that are respectively laminated on upper and lower surfaces of the first substrate and close the opening to form a cavity,

wherein an external dimension of the first substrate is larger than an external dimension of each of the second and third substrates, and an end portion of the first substrate protrudes from the second and third substrates.

2. The cavity substrate according to claim 1,

wherein conductor layers are respectively disposed on upper and lower surfaces of each of the first, second, and third substrates, and

wherein a through conductor to connect the conductor layers is disposed inside the first, second, and third substrates.

3. The cavity substrate according to claim 1, wherein the first substrate protrudes a length of 0.3-1.0 mm from an end surface of each of the second and third substrates.

4. A method of manufacturing a cavity substrate, comprising:

laminating second and third substrates on upper and lower surfaces of a first substrate having an opening and having an external dimension larger than an external dimension of each of the second and third substrates to ensure that an end portion of the first substrate protrudes a first length from the second and third substrates; and

cutting the end portion of the first substrate protruding from the second and third substrates to a second length smaller than the first length.

5. The method of manufacturing the cavity substrate according to claim 4, wherein the second length falls within a range of 0.3-1.0 mm from an end surface of each of the second and third substrates.

6. The method of manufacturing the cavity substrate according to claim 4,

wherein conductor layers are respectively disposed on upper and lower surfaces of each of the first, second, and third substrates, and

wherein a through conductor to connect each of the conductor layers is disposed in the first, second, and third substrates.