Ball bonding metal wire bond wires to metal pads
First Claim
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1. An apparatus for an integrated circuit package, comprising:
- a platform substrate having a copper pad without having a lower melting point interface layer;
an integrated circuit die coupled to the platform substrate;
a wire bond wire coupling a contact of the integrated circuit die and the copper pad;
a first end of the wire bond wire being ball bonded with a ball bond for direct contact with an upper surface of the copper pad; and
a second end of the wire bond wire being stitch bonded with a stitch bond to the contact;
wherein;
the wire bond wire is of a bond via array;
a first portion of the upper surface of the copper pad has thereon an organic solderability preservative layer;
a second portion of the upper surface of the copper pad is bare for the direct contact of the ball bond formed of the wire bond wire; and
the ball bond is formed with a thermal budget in a range of approximately 150 to 175°
C.
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Abstract
An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.
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Citations
3 Claims
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1. An apparatus for an integrated circuit package, comprising:
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a platform substrate having a copper pad without having a lower melting point interface layer; an integrated circuit die coupled to the platform substrate; a wire bond wire coupling a contact of the integrated circuit die and the copper pad; a first end of the wire bond wire being ball bonded with a ball bond for direct contact with an upper surface of the copper pad; and a second end of the wire bond wire being stitch bonded with a stitch bond to the contact; wherein; the wire bond wire is of a bond via array; a first portion of the upper surface of the copper pad has thereon an organic solderability preservative layer; a second portion of the upper surface of the copper pad is bare for the direct contact of the ball bond formed of the wire bond wire; and the ball bond is formed with a thermal budget in a range of approximately 150 to 175°
C. - View Dependent Claims (2, 3)
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Specification