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Ball bonding metal wire bond wires to metal pads

  • US 9,761,554 B2
  • Filed: 07/10/2015
  • Issued: 09/12/2017
  • Est. Priority Date: 05/07/2015
  • Status: Active Grant
First Claim
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1. An apparatus for an integrated circuit package, comprising:

  • a platform substrate having a copper pad without having a lower melting point interface layer;

    an integrated circuit die coupled to the platform substrate;

    a wire bond wire coupling a contact of the integrated circuit die and the copper pad;

    a first end of the wire bond wire being ball bonded with a ball bond for direct contact with an upper surface of the copper pad; and

    a second end of the wire bond wire being stitch bonded with a stitch bond to the contact;

    wherein;

    the wire bond wire is of a bond via array;

    a first portion of the upper surface of the copper pad has thereon an organic solderability preservative layer;

    a second portion of the upper surface of the copper pad is bare for the direct contact of the ball bond formed of the wire bond wire; and

    the ball bond is formed with a thermal budget in a range of approximately 150 to 175°

    C.

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