Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first transistor comprising a semiconductor material;
a wiring over the first transistor;
a first insulating layer over the wiring; and
a second transistor over the first insulating layer, the second transistor comprising;
an oxide semiconductor layer over the first insulating layer;
a source electrode and a drain electrode over the oxide semiconductor layer;
a first barrier layer between the oxide semiconductor layer and one of the source electrode and the drain electrode;
a second barrier layer between the oxide semiconductor layer and the other of the source electrode and the drain electrode;
a gate insulating layer over the source electrode and the drain electrode; and
a gate electrode over the gate insulating layer,wherein the semiconductor material comprises at least one of silicon, germanium, silicon germanium, silicon carbide, and gallium arsenide,wherein each of the first barrier layer and the second barrier layer comprises an oxide including indium, zinc and a first metal,wherein the oxide semiconductor layer comprises indium, zinc, and the first metal,wherein the first metal is one of aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cerium, neodymium, and hafnium,wherein the first barrier layer is in contact with the wiring through an opening provided in the first insulating layer,wherein the oxide semiconductor layer comprises a first region extending from one edge to the other edge of the oxide semiconductor layer when seen from a top of the semiconductor device, andwherein one of the first barrier layer and the second barrier layer, one of the source electrode and the drain electrode, and the gate electrode overlap with an entirety of the first region of the oxide semiconductor layer when seen from the top of the semiconductor device.
1 Assignment
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Accused Products
Abstract
A highly reliable semiconductor device which uses an oxide semiconductor and in which a change in the electrical characteristics is suppressed is provided. The semiconductor device includes an island-shaped semiconductor layer over a base insulating layer, a pair of electrodes over the semiconductor layer, a barrier layer in contact with undersurfaces of the electrodes, a gate electrode over the semiconductor layer, and a gate insulating layer between the semiconductor layer and the gate electrode. The semiconductor layer contains an oxide semiconductor. The base insulating layer contains silicon oxide or silicon oxynitride. The electrodes each contain Al, Cr, Cu, Ta, Ti, Mo, or W. The barrier layer contains oxide containing one or more metal elements contained in the oxide semiconductor. Furthermore, the electrodes and the barrier layer extend to the outside of the semiconductor layer when seen from above.
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Citations
23 Claims
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1. A semiconductor device comprising:
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a first transistor comprising a semiconductor material; a wiring over the first transistor; a first insulating layer over the wiring; and a second transistor over the first insulating layer, the second transistor comprising; an oxide semiconductor layer over the first insulating layer; a source electrode and a drain electrode over the oxide semiconductor layer; a first barrier layer between the oxide semiconductor layer and one of the source electrode and the drain electrode; a second barrier layer between the oxide semiconductor layer and the other of the source electrode and the drain electrode; a gate insulating layer over the source electrode and the drain electrode; and a gate electrode over the gate insulating layer, wherein the semiconductor material comprises at least one of silicon, germanium, silicon germanium, silicon carbide, and gallium arsenide, wherein each of the first barrier layer and the second barrier layer comprises an oxide including indium, zinc and a first metal, wherein the oxide semiconductor layer comprises indium, zinc, and the first metal, wherein the first metal is one of aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cerium, neodymium, and hafnium, wherein the first barrier layer is in contact with the wiring through an opening provided in the first insulating layer, wherein the oxide semiconductor layer comprises a first region extending from one edge to the other edge of the oxide semiconductor layer when seen from a top of the semiconductor device, and wherein one of the first barrier layer and the second barrier layer, one of the source electrode and the drain electrode, and the gate electrode overlap with an entirety of the first region of the oxide semiconductor layer when seen from the top of the semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device comprising:
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a first insulating layer over a wiring; an oxide semiconductor layer over the first insulating layer; a source electrode and a drain electrode over the oxide semiconductor layer; a first barrier layer between the oxide semiconductor layer and one of the source electrode and the drain electrode; a second barrier layer between the oxide semiconductor layer and the other of the source electrode and the drain electrode; a gate insulating layer over the source electrode and the drain electrode; and a gate electrode over the gate insulating layer, wherein each of the first barrier layer and the second barrier layer comprises an oxide including indium, zinc and a first metal, wherein the oxide semiconductor layer comprises indium, zinc, and the first metal, wherein the first metal is one of aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cerium, neodymium, and hafnium, wherein the first barrier layer is in contact with the wiring through an opening provided in the first insulating layer, and wherein an indium content of each of the first barrier layer and the second barrier layer is higher than an indium content of the oxide semiconductor layer. - View Dependent Claims (11, 12, 13, 14)
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15. A semiconductor device comprising:
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a first insulating layer over a wiring; an oxide semiconductor layer over the first insulating layer; a source electrode and a drain electrode over the oxide semiconductor layer; a first barrier layer between the oxide semiconductor layer and one of the source electrode and the drain electrode; a second barrier layer between the oxide semiconductor layer and the other of the source electrode and the drain electrode; a gate insulating layer over the source electrode and the drain electrode; and a gate electrode over the gate insulating layer, wherein each of the first barrier layer and the second barrier layer comprises an oxide including indium, zinc and a first metal, wherein the oxide semiconductor layer comprises indium, zinc, and the first metal, wherein the first metal is one of aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cerium, neodymium, and hafnium, and wherein the first barrier layer is in contact with the wiring through an opening provided in the first insulating layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification