Light-emitting element

• US 9,761,761 B2
• Filed: 02/11/2016
• Issued: 09/12/2017
• Est. Priority Date: 02/13/2015
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Daikoku, Shinichi, Kitahama, Shun, Emura, Keiji, Nakamura, Akihiro
• Primary Examiner(s): Trinh, (Vikki) Hoa B
• Application Number:
  US15/041,921
• Publication Number:
  US 20160240757A1
• Time in Patent Office: 579 Days
• CPC Class Codes: H01L 33/145 with a current-blocking structure
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

A light-emitting element includes a semiconductor stacked body, a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes, insulation films disposed in the plurality of through holes, the plurality of through holes being disposed on the semiconductor stacked body; and a pad electrode disposed on the light transmissive conductive film and the insulation films.

Claims

1. A light-emitting element comprising:

a semiconductor stacked body;

a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes;

a plurality of insulation films disposed in the plurality of through holes on the semiconductor stacked body, the plurality of insulating films including a first insulation film and a second insulation film; and

a pad electrode disposed on the light transmissive conductive film and the insulation films,

wherein the pad electrode includes an external connecting portion for electrically connecting to an outside and an extending portion extending from the external connecting portion,

wherein the first insulation film is disposed in a region directly below the external connecting portion, and the second insulation film is disposed in a region directly below the extending portion, and

wherein, in a plan view, the first insulation film is larger than the external connecting portion.

2. The light-emitting element according to claim 1,

wherein at least one of the insulation films is in contact with an inner surface of a corresponding through hole.

3. The light-emitting element according to claim 2,

wherein a portion of at least one of the insulation films is disposed on an upper surface of the light transmissive conductive film.

4. The light-emitting element according to claim 2,

wherein the light transmissive conductive film and the insulation film have approximately the same thickness.

5. The light-emitting element according to claim 2,

wherein at least a portion of the light transmissive conductive film is disposed on upper surfaces of the insulation films.

9. The light-emitting element according to claim 1,

wherein a plurality of the through holes of the light transmissive conductive film are disposed in the region directly below the extending portion,

wherein the plurality of insulating films include a plurality of second insulation films disposed in the plurality of through holes that are in the region directly below the extending portion, and

wherein the extending portion is continuously disposed on the upper surface of the light transmissive conductive film and the upper surfaces of the second insulation films.

13. The light-emitting element according to claim 1,

wherein the insulation films are DBR films.

14. The light-emitting element according to claim 1,

wherein a reflective film is disposed on the insulation films.

15. The light-emitting element according to claim 1,

wherein the light transmissive conductive film is made of ITO.

16. The light-emitting element according to claim 1,

wherein the insulation films are made of SiO2.

6. A light-emitting element comprising:

a semiconductor stacked body;

a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes;

a plurality of insulation films disposed in the plurality of through holes on the semiconductor stacked body, the plurality of insulating films including a first insulation film and a second insulation film; and

a pad electrode disposed on the light transmissive conductive film and the insulation films,

wherein a portion of at least one of the insulation films is disposed on an upper surface of the light transmissive conductive film,

wherein the pad electrode includes an external connecting portion for electrically connecting to an outside and an extending portion extending from the external connecting portion,

wherein the first insulation film is disposed in a region directly below the external connecting portion, and the second insulation film is disposed in a region directly below the extending portion, and

wherein, in a plan view, the first insulation film is larger than the external connecting portion.

10. The light-emitting element according to claim 6,

wherein a plurality of the through holes of the light transmissive conductive film are disposed in the region directly below the extending portion,

wherein the plurality of insulating films include a plurality of second insulation films disposed in the plurality of through holes that are in the region directly below the extending portion, and

wherein the extending portion is continuously disposed on the upper surface of the light transmissive conductive film and the upper surfaces of the second insulation films.

7. A light-emitting element comprising:

a semiconductor stacked body;

a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes;

a plurality of insulation films disposed in the plurality of through holes on the semiconductor stacked body, the plurality of insulating films including a first insulation film and a second insulation film; and

a pad electrode disposed on the light transmissive conductive film and the insulation films,

wherein the light transmissive conductive film and the insulation film have approximately the same thickness,

wherein the pad electrode includes an external connecting portion for electrically connecting to an outside and an extending portion extending from the external connecting portion,

wherein the first insulation film is disposed in a region directly below the external connecting portion, and the second insulation film is disposed in a region directly below the extending portion, and

wherein, in a plan view, the first insulation film is larger than the external connecting portion.

11. The light-emitting element according to claim 7,

wherein a plurality of the through holes of the light transmissive conductive film are disposed in the region directly below the extending portion,

wherein the plurality of insulating films include a plurality of second insulation films disposed in the plurality of through holes that are in the region directly below the extending portion, and

wherein the extending portion is continuously disposed on the upper surface of the light transmissive conductive film and the upper surfaces of the second insulation films.

8. A light-emitting element comprising:

a semiconductor stacked body;

a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes;

a plurality of insulation films disposed in the plurality of through holes on the semiconductor stacked body, the plurality of insulating films including a first insulation film and a second insulation film; and

a pad electrode disposed on the light transmissive conductive film and the insulation films,

wherein at least a portion of the light transmissive conductive film is disposed on upper surfaces of the insulation films,

wherein the pad electrode includes an external connecting portion for electrically connecting to an outside and an extending portion extending from the external connecting portion,

wherein the first insulation film is disposed in a region directly below the external connecting portion, and the second insulation film is disposed in a region directly below the extending portion, and

wherein, in a plan view, the first insulation film is larger than the external connecting portion.

12. The light-emitting element according to claim 8,

wherein a plurality of the through holes of the light transmissive conductive film are disposed in the region directly below the extending portion,

wherein the plurality of insulating films include a plurality of second insulation films disposed in the plurality of through holes that are in the region directly below the extending portion, and

wherein the extending portion is continuously disposed on the upper surface of the light transmissive conductive film and the upper surfaces of the second insulation films.