Wavelength converted semiconductor light emitting device
First Claim
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1. A light emitting device comprising:
- a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;
a first wavelength converting layer disposed in a path of light emitted by the light emitting layer, wherein the first wavelength converting layer comprises a wavelength converting ceramic; and
a second wavelength converting layer fused to the first wavelength converting layer, wherein the second wavelength converting layer comprises a wavelength converting material disposed in glass, wherein the first wavelength converting layer is disposed between the second wavelength converting layer and the semiconductor structure.
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Abstract
In embodiments of the invention, a light emitting device includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A first wavelength converting layer is disposed in a path of light emitted by the light emitting layer. The first wavelength converting layer may be a wavelength converting ceramic. A second wavelength converting layer is fused to the first wavelength converting layer. The second wavelength converting layer may be a wavelength converting material disposed in glass.
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Citations
8 Claims
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1. A light emitting device comprising:
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a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region; a first wavelength converting layer disposed in a path of light emitted by the light emitting layer, wherein the first wavelength converting layer comprises a wavelength converting ceramic; and a second wavelength converting layer fused to the first wavelength converting layer, wherein the second wavelength converting layer comprises a wavelength converting material disposed in glass, wherein the first wavelength converting layer is disposed between the second wavelength converting layer and the semiconductor structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification