Semiconductor light source

• US 9,761,775 B2
• Filed: 04/22/2013
• Issued: 09/12/2017
• Est. Priority Date: 08/24/2001
• Status: Expired due to Term

• Current Assignee: Satco Products Incorporated
• Original Assignee: Epistar Corporation (Ennostar, Inc.)
• Inventors: Cao, Densen
• Primary Examiner(s): Jackson, Jr., Jerome
• Application Number:
  US13/867,943
• Publication Number:
  US 20130234174A1
• Time in Patent Office: 1,604 Days
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A light source may comprise a thermally conductive frame comprising a base and a faceted portion extending from the base. The faceted portion may comprise a plurality of facets spaced circumferentially thereabout. Additionally, a hollow passageway may extend through the base and axially through the faceted portion. A plurality of LED chips may be arranged on the plurality of facets to provide an emission of light in an arc of 360 degrees.

Claims

1. A light source, comprising:

a base;

a faceted portion arranged on the base, and comprising a bottom width and a plurality of facets;

a hollow passageway surrounded by the plurality of facets, and comprising a top opening and a bottom opening;

a pin passing through the hollow passageway from the top opening to the bottom opening;

an electric insulator arranged between the pin and the faceted portion;

a shaft arranged under the base and having a top width substantially equal to the bottom width in a cross-sectional view; and

a plurality of LED chips arranged on the plurality of facets and electrically connected to the pin.

2. The light source of claim 1, wherein each facet of the plurality of facets has at least one LED chip positioned thereon.

3. The light source of claim 1, wherein at least one LED chip of the plurality of LED chips is covered with a light conversion layer.

4. The light source of claim 3, wherein each LED chip of the plurality of LED chips is covered with a light conversion layer.

5. The light source of claim 4, wherein the light conversion layer comprises a phosphorous material.

6. The light source of claim 1, wherein at least one of the plurality of facets has an orientation not parallel to the base.

7. The light source of claim 1, further comprising a transparent cap sealing the plurality of LED chips and the faceted portion.

8. The light source of claim 1, wherein the electric insulator has a portion arranged on the top opening.

13. The light source of claim 1, wherein the electric insulator has a surface coplanar with an outer surface of the faceted portion.

9. A light source, comprising:

a base;

a faceted portion arranged on the base, and comprising a bottom width and a plurality of facets;

a hollow passageway surrounded by the plurality of facets, and comprising a top opening and a bottom opening;

a pin passing through the hollow passageway from the top opening to the bottom opening;

an electric insulator arranged between the pin and the faceted portion;

a shaft arranged under the base and having a top width substantially equal to the bottom width in a cross-sectional view; and

a plurality of LED chips electrically connected to the pin, each LED chip covered by a light conversion layer, the plurality of LED chips arranged on each respective facet of the plurality of facets to provide an emission of light in an arc of 360 degrees.

10. The light source of claim 9, wherein the light conversion layer comprises a phosphorous material.

11. The light source of claim 9, wherein the electric insulator has a portion arranged on the top opening.

12. The light source of claim 9, wherein the electric insulator has a surface coplanar with an outer surface of the faceted portion.