Integrated circuit package including miniature antenna
First Claim
1. A device comprising:
- a substrate;
a chip mounted in a first area of the substrate;
a first antenna disposed in a second area of the substrate, wherein the first antenna fits inside a first rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the first antenna; and
a second antenna disposed in a third area of the substrate, the first area being located between the second and third areas, wherein the second antenna fits inside a second rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the second antenna.
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Abstract
The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180° (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115°, wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.
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Citations
20 Claims
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1. A device comprising:
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a substrate; a chip mounted in a first area of the substrate; a first antenna disposed in a second area of the substrate, wherein the first antenna fits inside a first rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the first antenna; and a second antenna disposed in a third area of the substrate, the first area being located between the second and third areas, wherein the second antenna fits inside a second rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the second antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A sensor node comprising:
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a first substrate; a second substrate disposed on top of the first substrate; at least one die mounted in a first area of the second substrate; a sensing system connected to the first substrate; a first antenna disposed in a second area of the second substrate and configured to transmit electromagnetic signals, wherein the first antenna fits inside a first rectangular area, the longest side of the first rectangular area being shorter than one-fifth of a longest free-space operating wavelength of the first antenna. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A wireless module comprising:
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a substrate; at least one chip mounted in a first area of the substrate; an antenna disposed in a second area of the substrate, wherein the perimeter of the antenna defines a curve comprising at least five segments, each of the at least five segments forming an angle with each adjacent segment in the curve, each of the five segments being shorter than one-tenth of a longest free-space operating wavelength of the antenna, wherein the smaller angle of each angle between adjacent segments is less than 180° and
at least two of the angles between adjacent sections are less than 115°
, and at least two of the angles are not equal. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification