Methods of attaching components on fabrics using metal braids

• US 9,763,326 B1
• Filed: 06/13/2014
• Issued: 09/12/2017
• Est. Priority Date: 12/09/2013
• Status: Active Grant

• Current Assignee: Flextronics America LLC (Flextronics International Limited)
• Original Assignee: Flextronics America LLC (Flextronics International Limited)
• Inventors: Liu, Weifeng, Feng, Zhen, Mohammed, Anwar
• Primary Examiner(s): Nguyen, Hoa C
• Assistant Examiner(s): Tso, Stanley
• Application Number:
  US14/304,029
• Time in Patent Office: 1,187 Days
• Field of Search: 2905, 361760
• CPC Class Codes: A41D 1/002 adapted to accommodate electronic equipment patients' garments for medical monitoring A41D13/1281; luminous ornaments A41D27/085
• CPC Class Codes: A41D 1/005 with embedded cable or connector
• CPC Class Codes: D05B 17/00 Sewing machines for concurrently making thread and welded seams for making non-welded fluid-tight seams D05B1/26
• CPC Class Codes: H01M 10/0436 Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 6/12 with flat electrodes
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: H01R 4/00 Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H01R 4/029 Welded connections H01R4/021 - H01R4/028 take precedence
• CPC Class Codes: H01R 43/005 for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H01R 43/0235 for applying solder H01R43/0228 takes precedence
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/11 : Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/112 : directly combined with via connections
• CPC Class Codes: H05K 1/115 : Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 13/04 : Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 2201/0154 : Polyimide
• CPC Class Codes: H05K 2201/0158 : Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
• CPC Class Codes: H05K 2201/0162 : Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/0287 : Unidirectional or parallel fibers
• CPC Class Codes: H05K 2201/05 : Flexible printed circuits [FPCs]
• CPC Class Codes: H05K 2201/09418 : Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/42 : Plated through-holes or plated via connections
• CPC Class Codes: H05K 3/4644 : by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 7/02 : Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: H05K 9/009 : comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.

Claims

1. An electronics assembly comprising:

a. a fabric;

b. an electronic component comprising first and second electrical connection points;

c. first and second electrically conductive wire braids, the first electrically conductive wire braid coupled to and in contact with the first electrical connection point of the electronic component and positioned between the fabric and the first electrical connection point, wherein a first direct electrical connection is formed between the first electrically conductive wire braid and the first electrical connection point, and the second electrically conductive wire braid coupled to and in contact with the second electrical connection point of the electronic component and positioned between the fabric and the second electrical connection point, wherein a second direct electrical connection is formed between the second electrically conductive wire braid and the second electrical connection point;

d. first and second electrically conductive wires stitched to the fabric and to the respective first and second electrically conductive wire braids such that a first electrical connection is formed between the first electrically conductive wire and the first electrically conductive wire braid, wherein the first electrically conductive wire is stitched to the fabric and to the first electrically conductive wire braid without the first electrically conductive wire physically contacting the electronic component and the first electrical connection point and such that a second electrical connection is formed between the second electrically conductive wire and the second electrically conductive wire braid, wherein the second electrically conductive wire is stitched to the fabric and to the second electrically conductive wire braid without the second electrically conductive wire physically contacting the electronic component and the second electrical connection point;

e. wherein each of the first and second electrically conductive wires comprises two separate wires, wherein the two separate wires comprise a metal wire and an insulation wire;

f. wherein the fabric comprises an insulated wire including an inner metal magnet wire and an outer insulation layer; and

g. wherein the first electrically conductive wire is electrically coupled to the inner metal magnet wire of the insulated wire.

2. The electronics assembly of claim 1 wherein each of the first and second electrical connection points comprises a bond pad physically contacting the electronic component.

3. The electronics assembly of claim 1 wherein each of the first and second electrical connection points comprises a solder bump physically contacting the electronic component.

4. The electronics assembly of claim 1 wherein each of the first and second electrical connection points is coupled to the respective first and second electrically conductive wire braids via a solder joint, a welded joint or an electrically conductive adhesive.

5. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids is coupled to the fabric using an adhesive.

6. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids is coupled to the fabric using respective first and second stitched non-electrically conductive threads.

7. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids is coupled to the fabric using respective first and second electrically conductive threads stitched to the fabric and to the respective first and second electrically conductive wire braids.

8. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids comprises a plurality of electrically conductive wires.

9. The electronics assembly of claim 8 wherein each of the plurality of electrically conductive wires comprise a metal wire made of one or more of copper, silver, nickel and their alloys.

10. The electronics assembly of claim 8 wherein each of the plurality of electrically conductive wires comprise an electrically conductive plating finish.

11. The electronics assembly of claim 8 wherein each of the plurality of electrically conductive wires comprise an electrically conductive polymer.

12. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids comprises a plurality of electrically conductive wires braided together.

13. The electronics assembly of claim 1 further comprising an encapsulation layer coupled to the electronics component, the first and second electrically conductive wire braids and the first and second electrically conductive wires.

14. The electronics assembly of claim 1 wherein the electronics assembly is wearable.

15. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids comprises a first end coupled to and in contact with the respective first and second electrical connection points of the electronic component and a second end that is stitched to the fabric using the respective first and second electrically conductive wires, further wherein the first end is further coupled to the fabric.

16. The electronics assembly of claim 1 wherein each of the first and second electrical connection points is located within a footprint of the electronic component.

17. A method of making an electronics assembly, the method comprising:

a. attaching a first electrical connection point of an electronic component in contact with a first electrically conductive wire braid, thereby forming a direct first electrical connection between the first electrically conductive wire braid and the first electrical connection point, and attaching a second electrical connection point of the electronic component in contact with a second electrically conductive wire braid, thereby forming a direct second electrical connection between the second electrically conductive wire braid and the second electrical connection point;

b. attaching the first and second electrically conductive wire braids to a fabric, wherein the first electrically conductive wire braid is positioned between the fabric and the first electrical connection point, and the second electrically conductive wire braid is positioned between the fabric and the second electrical connection point;

d. stitching a first electrically conductive wire to the fabric and to the first electrically conductive wire braid such that a first electrical connection is formed between the first electrically conductive wire and the first electrically conductive wire braid, wherein the first electrically conductive wire is stitched to the fabric and to the first electrically conductive wire braid without the first electrically conductive wire physically contacting the electronic component and the first electrical connection point, and stitching a second electrically conductive wire to the fabric and to the second electrically conductive wire braid such that a second electrical connection is formed between the second electrically conductive wire and the second electrically conductive wire braid, wherein the second electrically conductive wire is stitched to the fabric and to the second electrically conductive wire braid without the second electrically conductive wire physically contacting the electronic component and the second electrical connection point; and

e. wherein each of the first and second electrically conductive wires comprises two separate wires, the two separate wires comprise a metal wire and an insulation wire each stitched to the fabric, further wherein the fabric comprises an insulated wire including an inner metal magnet wire and an outer insulation layer, and the first electrically conductive wire is electrically coupled to the inner metal magnet wire of the insulated wire.

18. The method of claim 17 wherein attaching each of the first and second electrical connection points to the respective first and second electrically conductive wire braids comprises soldering, welding or using an electrically conductive adhesive.

19. The method of claim 17 wherein attaching each of the first and second electrically conductive wire braids to the fabric comprises using an adhesive.

20. The method of claim 17 wherein attaching each of the first and second electrically conductive wire braids to the fabric comprises stitching first and second non-electrically conductive threads to the respective first and second electrically conductive wire braids and to the fabric.

21. The method of claim 17 wherein attaching each of the first and second electrically conductive wire braids to the fabric comprises stitching first and second electrically conductive threads to the respective first and second electrically conductive wire braids and to the fabric.

22. The method of claim 17 further comprising adding an encapsulation layer coupled to the electronics component, the first and second electrically conductive wire braids and the first and second electrically conductive wires.

23. The method of claim 17 wherein the electronics assembly is wearable.

24. The method of claim 17 wherein each of the first and second electrical connection points of the electronic component is attached to the respective first and second electrically conductive wire braids such that an interior side surface of each of the first and second electrical connection points of the electronic component is aligned with an interior side surface of the respective first and second electrically conductive wire braids and such that an exterior side surface of each of the first and second electrically conductive wire braids extends beyond a footprint of the electronic component.