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Techniques for observing an entire communication bus in operation

  • US 9,763,329 B1
  • Filed: 03/11/2016
  • Issued: 09/12/2017
  • Est. Priority Date: 03/11/2016
  • Status: Active Grant
First Claim
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1. A circuit board, comprising:

  • conductive traces being sandwiched by an upper insulating layer and a lower insulating layer;

    a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other; and

    isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, wherein the conductive traces include a first group of conductive traces, each of the conductive traces in the first group of conductive traces being coupled to a different conductive via in the first array of conductive vias through one of the isolation resistors, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor, each isolation resistor being configured to produce a copy of a signal flowing through the conductive via that is coupled to one end of the isolation resistor on the conductive trace that is coupled to an opposite end of the isolation resistor.

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