Fabricating a liquid-cooling apparatus with coolant filter

• US 9,763,357 B2
• Filed: 08/14/2015
• Issued: 09/12/2017
• Est. Priority Date: 12/18/2013
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Campbell, Levi A., Chu, Richard C., David, Milnes P., Ellsworth, Jr., Michael J., Iyengar, Madhusudan K., Schmidt, Roger R., Simons, Robert E.
• Primary Examiner(s): Nguyen, Donghai D
• Application Number:
  US14/826,433
• Publication Number:
  US 20150359139A1
• Time in Patent Office: 760 Days
• Field of Search: 29830, 2989003, 165 8004, 16510433, 361689, 361694, 361699, 361701, 361703
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

Methods of fabricating cooling apparatuses with coolant filters are provided which facilitate heat transfer from an electronic component(s). The method includes providing a cooling apparatus which includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. A coolant loop is also provided coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

Claims

1. A method comprising:

providing a liquid-cooled heat sink configured to facilitate cooling at least one electronic component, the liquid-cooled heat sink comprising;

a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;

a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough; and

wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;

coupling a coolant loop to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof;

providing a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink;

wherein the coolant filter is positioned within the thermally conductive structure of the liquid-cooled heat sink upstream of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment; and

wherein the coolant-carrying compartment comprises a converging inlet plenum with angled inner walls converging towards the region of reduced cross-sectional coolant flow area, and the coolant filter is disposed within the converging inlet plenum in contact with the angled inner walls thereof.

2. The method of claim 1, wherein the cross-sectional coolant flow area of the coolant filter is at least twice as large as the cross-sectional coolant flow area of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink.

3. The method of claim 1, wherein the coolant filter is replaceable, with the liquid-cooled heat sink coupled to the at least one electronic component to be cooled.

4. The method of claim 1, wherein the region of reduced cross-sectional coolant flow area comprises a coolant flow opening with a critical coolant flow dimension less than 0.5 mm.

5. A method comprising:

providing a liquid-cooled heat sink configured to facilitate cooling at least one electronic component, the liquid-cooled heat sink comprising;

a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;

a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough; and

wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;

coupling a coolant loop to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof;

providing a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink;

wherein the coolant filter is positioned within the thermally conductive structure of the liquid-cooled heat sink upstream of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment; and

wherein the coolant filter encircles the region of reduced cross-sectional coolant flow area within the coolant-carrying compartment, and the coolant outlet is disposed over the region of reduced cross-sectional flow area, and wherein coolant enters the coolant-carrying compartment through the coolant inlet, passes through the coolant filter into the region of reduced cross-sectional coolant flow area before exiting the coolant-carrying compartment through the coolant outlet disposed over the region of reduced cross-sectional coolant flow area.

6. The method of claim 5, wherein the coolant traverses through at least a portion of the reduced cross-sectional coolant flow area of the coolant-carrying compartment of the thermally conductive structure and exhausts from the thermally conductive structure over the region of reduced cross-sectional coolant flow area.

7. A method comprising:

providing a liquid-cooled heat sink configured to facilitate cooling at least one electronic component, the liquid-cooled heat sink comprising;

a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;

a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough; and

wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;

coupling a coolant loop to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof;

providing a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink;

wherein the coolant filter is associated with a coolant loop for filtering the coolant before egressing via the coolant inlet into the coolant-carrying compartment of the thermally conductive structure of the liquid cooled heat sink; and

wherein the coolant filter is disposed upstream of the liquid-cooled heat sink within a coolant loop connection subassembly, wherein the cross-sectional coolant flow area of the coolant filter is larger than a cross-sectional coolant flow area of the coolant loop.

8. The method of claim 7, wherein the coolant filter is disposed within a coolant filter subassembly, the coolant filter subassembly comprising a first end and a second end which couple in fluid communication with the coolant loop to facilitate flow of coolant within the coolant loop through the coolant filter, the first end and the second end comprising a first quick connect coupler and a second quick connect coupler, respectively.