Filling vacant areas of an integrated circuit design
First Claim
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1. A method comprising:
- using a computer, automatically creating a first shape comprising rectangles that is representative of free space on a first layer of an integrated circuit design;
automatically creating a second shape comprising rectangles that is representative of free space on a second layer of the integrated circuit design, wherein the second layer is different from the first layer;
automatically creating a first via shape in a third layer, different from the first and second layers, that overlaps both the first and second shapes;
determining whether the first shape is further coupled to a third shape on a fourth layer, different from the first and second layers, wherein the third shape is representative of a power voltage net;
if the first shape has a further coupling to the third shape, not discarding the first shape and the first via shape; and
forming an integrated circuit from the integrated circuit design.
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Abstract
Vacant areas of a layer of an integrated circuit design are filled with shapes connected to the appropriate nets.
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Citations
25 Claims
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1. A method comprising:
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using a computer, automatically creating a first shape comprising rectangles that is representative of free space on a first layer of an integrated circuit design; automatically creating a second shape comprising rectangles that is representative of free space on a second layer of the integrated circuit design, wherein the second layer is different from the first layer; automatically creating a first via shape in a third layer, different from the first and second layers, that overlaps both the first and second shapes; determining whether the first shape is further coupled to a third shape on a fourth layer, different from the first and second layers, wherein the third shape is representative of a power voltage net; if the first shape has a further coupling to the third shape, not discarding the first shape and the first via shape; and forming an integrated circuit from the integrated circuit design. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A system comprising:
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a computer configured to automatically create a first shape comprising rectangles that is representative of free space on a first layer of an integrated circuit design, automatically create a second shape comprising rectangles that is representative of free space on a second layer of the integrated circuit design, wherein the second layer is different from the first layer, automatically create a first via shape in a third layer, different from the first and second layers, that overlaps both the first and second shapes, determine whether the first shape is further coupled to a third shape on the second layer, wherein the third shape is representative of a power voltage net, and if the first shape has a further coupling to the third shape, not discard the first shape and the first via shape; and at least one photolithography mask that is used for the fabrication of an integrated circuit, wherein the photolithography mask comprises at least one feature based on the third layer. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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23. A method comprising:
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using a computer, automatically creating a first shape comprising rectangles that is representative of free space on a first layer of an integrated circuit design; automatically creating a second shape comprising rectangles that is representative of free space on a second layer of the integrated circuit design, wherein the second layer is different from the first layer; automatically creating a first via shape in a third layer, different from the first and second layers, that overlaps both the first and second shapes; when the first and second shapes do not overlap, finding a third shape on the second layer that was not automatically generated; automatically creating a second via shape in the third layer that overlaps both the first and third shapes; determining whether the first shape is further coupled to a third shape on a fourth layer, different from the first and second layers, wherein the third shape is representative of a power voltage net; determining whether the first shape is further coupled to a fourth shape on the second layer, wherein the third shape is representative of a power voltage net; if the first shape has a further coupling to a third or fourth shape, not discarding the first shape and the first via shape; and forming an integrated circuit from the integrated circuit design. - View Dependent Claims (24, 25)
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Specification