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Method for manufacturing semiconductor device

  • US 9,768,281 B2
  • Filed: 03/24/2015
  • Issued: 09/19/2017
  • Est. Priority Date: 03/12/2009
  • Status: Active Grant
First Claim
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1. A manufacturing method of a semiconductor device comprising:

  • forming an oxide semiconductor layer over a first insulating layer;

    forming a first conductive layer electrically connected to the oxide semiconductor layer;

    forming a second insulating layer over the oxide semiconductor layer and the first conductive layer;

    performing a first heat treatment before forming the second insulating layer; and

    performing a second heat treatment after forming the second insulating layer,wherein a hydrogen concentration in the second insulating layer is lower than a hydrogen concentration in the oxide semiconductor layer.

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