Oxide semiconductor
First Claim
1. An oxide semiconductor comprising:
- an aggregation of a plurality of crystals,wherein the plurality of crystals includes indium,wherein each of the plurality of crystals has a size larger than or equal to 1 nm and smaller than or equal to 3 nm, andwherein half widths at half maximum of a diffraction peak of the oxide semiconductor is 0.4 nm−
1 to 0.6 nm−
1.
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Abstract
To provide an oxide semiconductor with a novel structure. Such an oxide semiconductor is composed of an aggregation of a plurality of InGaZnO4 crystals each of which is larger than or equal to 1 nm and smaller than or equal to 3 nm, and in the oxide semiconductor, the plurality of InGaZnO4 crystals have no orientation. Alternatively, such an oxide semiconductor is such that a diffraction pattern like a halo pattern is observed by electron diffraction measurement performed by using an electron beam with a probe diameter larger than or equal to 300 nm, and that a diffraction pattern having a plurality of spots arranged circularly is observed by electron diffraction measurement performed by using an electron beam with a probe diameter larger than or equal to 1 nm and smaller than or equal to 30 nm.
175 Citations
9 Claims
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1. An oxide semiconductor comprising:
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an aggregation of a plurality of crystals, wherein the plurality of crystals includes indium, wherein each of the plurality of crystals has a size larger than or equal to 1 nm and smaller than or equal to 3 nm, and wherein half widths at half maximum of a diffraction peak of the oxide semiconductor is 0.4 nm−
1 to 0.6 nm−
1. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An oxide semiconductor comprising:
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indium, wherein a diffraction pattern having a plurality of spots circularly arranged is observed when an electron diffraction measurement is performed on the oxide semiconductor by using an electron beam with a probe diameter larger than or equal to 1 nm and smaller than or equal to 30 nm, wherein a diffraction pattern with no spot is observed when an electron diffraction measurement is performed on the oxide semiconductor by using an electron beam with a probe diameter larger than or equal to 300 nm, wherein a grain boundary is not observed in a TEM image of the oxide semiconductor, and wherein half widths at half maximum of a diffraction peak of the oxide semiconductor is 0.4 nm−
1 to 0.6 nm−
1. - View Dependent Claims (8, 9)
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Specification