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Method and system for implementing high-speed interfaces between semiconductor dies in optical communication systems

  • US 9,772,460 B2
  • Filed: 02/23/2011
  • Issued: 09/26/2017
  • Est. Priority Date: 02/23/2010
  • Status: Active Grant
First Claim
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1. A method for processing signals, the method comprising:

  • in an optical communication system, communicating electrical signals between an electronics die and an optoelectronics die via coupling pads on said electronics die and said optoelectronics die, wherein said coupling pads are located at low impedance points between two cascode transistors in one or more transmit paths and/or one or more receive paths in said optical communication system, wherein a first of said two cascode transistors is integrated in said electronics die and a second of said two cascode transistors is integrated in said optoelectronics die.

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