Methods of forming patterns using photoresists
First Claim
Patent Images
1. A method of forming a pattern, the method comprising:
- sequentially forming a lower coating layer and a photoresist layer on an object layer that is on a substrate, the photoresist layer being formed of a photoresist composition including a negative-tone photoresist polymer and a photoacid generator;
performing an exposure process such that the photoresist layer is divided into an exposed portion and a non-exposed portion;
transforming a portion of the lower coating layer overlapping or contacting the exposed portion at least partially into a polarity conversion portion that has a polarity substantially identical to that of the exposed portion such that the polarity conversion portion is formed by diffusing acid generated from the photoacid generator into the portion of the lower coating layer under the exposed portion; and
selectively removing the non-exposed portion of the photoresist layer.
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Abstract
In a method of forming a pattern, a lower coating layer and a photoresist layer are sequentially formed on an object layer. An exposure process may be performed such that the photoresist layer is divided into an exposed portion and a non-exposed portion. A portion of the lower coating layer overlapping or contacting the exposed portion is at least partially transformed into a polarity conversion portion that has a polarity substantially identical to that of the exposed portion. The non-exposed portion of the photoresist layer is selectively removed.
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Citations
18 Claims
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1. A method of forming a pattern, the method comprising:
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sequentially forming a lower coating layer and a photoresist layer on an object layer that is on a substrate, the photoresist layer being formed of a photoresist composition including a negative-tone photoresist polymer and a photoacid generator; performing an exposure process such that the photoresist layer is divided into an exposed portion and a non-exposed portion; transforming a portion of the lower coating layer overlapping or contacting the exposed portion at least partially into a polarity conversion portion that has a polarity substantially identical to that of the exposed portion such that the polarity conversion portion is formed by diffusing acid generated from the photoacid generator into the portion of the lower coating layer under the exposed portion; and selectively removing the non-exposed portion of the photoresist layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a pattern, the method comprising:
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forming a lower coating layer on an object layer that is on a substrate, the lower coating layer including a polymer to which a polarity conversion group is combined; forming a photoresist layer on the lower coating layer; performing an exposure process on the photoresist layer such that the photoresist layer is divided into an exposed portion having a converted polarity and a non-exposed portion retaining a polarity thereof; inducing a dehydration reaction in the polarity conversion group included in a portion of the lower coating layer under the exposed portion; and removing the non-exposed portion of the photoresist layer, wherein the polarity conversion group is represented by one of the following formulae; - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of forming a pattern, the method comprising:
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forming an isolation layer on a substrate such that an active pattern is defined by the isolation layer; sequentially forming a lower coating layer and a photoresist layer on the active pattern and the isolation layer, the photoresist layer being formed of a photoresist composition including a negative-tone photoresist polymer and a photoacid generator; performing an exposure process such that the photoresist layer is divided into an exposed portion and a non-exposed portion; transforming a portion of the lower coating layer overlapping or contacting the exposed portion at least partially into a polarity conversion portion that has a polarity substantially identical to that of the exposed portion such that the polarity conversion portion is formed by diffusing acid generated from the photoacid generator into the portion of the lower coating layer under the exposed portion; selectively removing the non-exposed portion of the photoresist layer; and partially removing the active pattern using the exposed portion as an etching mask. - View Dependent Claims (17, 18)
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Specification