FETs and methods of forming FETs
First Claim
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1. A method comprising:
- forming a first fin and a second fin, the first fin and the second fin each comprising a substrate semiconductor material, a first crystalline semiconductor material above the substrate semiconductor material, and a second crystalline semiconductor material above the first crystalline semiconductor material, wherein the first crystalline semiconductor material is a different material from the second crystalline semiconductor material;
converting the first crystalline semiconductor material in the first fin to a first dielectric material, wherein after the converting the first crystalline semiconductor material step, at least a portion of the first crystalline semiconductor material in the first fin remains unconverted;
converting all of the first crystalline semiconductor material in the second fin to a second dielectric material;
forming gate structures over the first fin and the second fin; and
forming source/drain regions on opposing sides of the gate structures.
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Abstract
An embodiment is a method including forming a first fin and a second fin on a substrate, the first fin and the second fin each including a first crystalline semiconductor material on a substrate and a second crystalline semiconductor material above the first crystalline semiconductor material. Converting the first crystalline semiconductor material in the second fin to a dielectric material, wherein after the converting step, at least a portion of the first crystalline semiconductor material in the first fin remains unconverted. Forming gate structures over the first fin and the second fin, and forming source/drain regions on opposing sides of the gate structures.
31 Citations
20 Claims
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1. A method comprising:
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forming a first fin and a second fin, the first fin and the second fin each comprising a substrate semiconductor material, a first crystalline semiconductor material above the substrate semiconductor material, and a second crystalline semiconductor material above the first crystalline semiconductor material, wherein the first crystalline semiconductor material is a different material from the second crystalline semiconductor material; converting the first crystalline semiconductor material in the first fin to a first dielectric material, wherein after the converting the first crystalline semiconductor material step, at least a portion of the first crystalline semiconductor material in the first fin remains unconverted; converting all of the first crystalline semiconductor material in the second fin to a second dielectric material; forming gate structures over the first fin and the second fin; and forming source/drain regions on opposing sides of the gate structures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 20)
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10. A method comprising:
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epitaxially growing a first crystalline semiconductor material on a substrate; epitaxially growing a second crystalline semiconductor material above the first crystalline semiconductor material; patterning the first crystalline semiconductor material and the second crystalline semiconductor material to form a first fin and second fin on the substrate; oxidizing at least a portion of the first crystalline semiconductor material in the first fin and all of the first crystalline semiconductor material in the second fin to form a first oxide material, and oxidizing at least a portion of the second crystalline semiconductor material in the first fin and the second fin to form a second oxide material, wherein after the oxidizing of the first fin and the second fin, a portion of the first crystalline semiconductor material in the first fin is not oxidized; removing at least a portion of the second oxide material; forming isolation regions on the substrate and surrounding at least lower portions of the first fin and the second fin; forming gate structures over the first fin, the second fin, and the isolation regions; and forming source/drain regions on opposing sides of the gate structures. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A method comprising:
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forming a first fin and a second fin on a substrate, the first fin and the second fin each comprising a first crystalline semiconductor material on a substrate and a second crystalline semiconductor material above the first crystalline semiconductor material; oxidizing the second fin to oxidize all of the first crystalline semiconductor material in the second fin to form a first oxide material; oxidizing the first fin to oxidize a portion of the first crystalline semiconductor material in the first fin to form a second oxide material, wherein after the oxidizing of the first fin, a portion of the first crystalline semiconductor material in the first fin is not oxidized; removing a portion of the first and second oxide materials; forming isolation regions on the substrate and surrounding at least lower portions of the first fin and the second fin; forming gate structures over the first fin, the second fin, and the isolation regions; and forming source/drain regions on opposing sides of the gate structures. - View Dependent Claims (18, 19)
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Specification