Polishing stop layer(s) for processing arrays of semiconductor elements

• US 9,773,974 B2
• Filed: 04/13/2016
• Issued: 09/26/2017
• Est. Priority Date: 07/30/2015
• Status: Active Grant

• Current Assignee: Integrated Silicon Solution Incorporated (Uphill Investment Co.)
• Original Assignee: Spin Transfer Technologies, Inc.
• Inventors: Pinarbasi, Mustafa Michael, Hernandez, Jacob Anthony, Datta, Arindom, Gajek, Marcin Jan, Zantye, Parshuram Balkrishna
• Primary Examiner(s): Sengdara, Vongsavanh
• Application Number:
  US15/097,576
• Publication Number:
  US 20170033283A1
• Time in Patent Office: 531 Days
• Field of Search: 257427, 438 3
• CPC Class Codes: H10B 61/00 Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
• CPC Class Codes: H10N 50/01 Manufacture or treatment
• CPC Class Codes: H10N 50/10 Magnetoresistive devices
• CPC Class Codes: H10N 50/80 Constructional details

Abstract

Described embodiments can be used in semiconductor manufacturing and employ materials with high and low polish rates to help determine a precise polish end point that is consistent throughout a wafer and that can cease polishing prior to damaging semiconductor elements. The height of the low polish rate material between the semiconductor elements is used as the polishing endpoint. Because the low polish rate material slows down the polishing process, it is easy to determine an end point and avoid damage to the semiconductor elements. An additional or alternative etch end point can be a thin layer of material that provides a very clear spectroscopy signal when it has been exposed, allowing the etch process to cease.

Claims

1. A method manufacturing a semiconductor device comprising:

fabricating a plurality of magnetic tunnel junction (MTJ) pillars on a wafer, each of the plurality of MTJ pillars having a top surface and a side surface, the top surface extending at an MTJ pillar height from the wafer;

depositing a first layer on the semiconductor wafer, the first layer being comprised of a high chemical-mechanical polish (CMP) rate material, such that the first layer covers the top surface and side surface of each of the plurality of MTJ pillars, the first layer forming a first layer bump portion over the top surface of each of the plurality of MTJ pillars and a first layer side surface portion over the side surface of each of the plurality of MTJ pillars and a plurality of first layer valley portions in between the plurality of MTJ pillars;

depositing a second layer over the first layer, the second layer being comprised of a low CMP rate material, such that a second layer bump portion covers the first layer bump portion, a second layer side portion covers the first layer side portion, and a plurality of second layer valley portions cover the plurality of first layer valley portions, thereby forming a plurality of MTJ pillar bumps, each of the plurality of MTJ pillar bumps corresponding to the top surface of each of the plurality of MTJ pillars, the second layer having a thickness selected such that a top surface of the plurality of second layer valley portions are at a CMP stop height, the low CMP rate material having a lower polish rate than the polish rate of the high CMP rate material;

chemical-mechanical polishing the plurality of MTJ pillar bumps with a chemical-mechanical polisher;

detecting that the chemical-mechanical polisher has reached the top surface of second layer valley portions; and

stopping the chemical-mechanical polishing step when the polisher has reached the top surface of the plurality of second layer valley portions such that the side surface of each of the plurality of MTJ pillars remains covered by the first layer and the second layer.

2. The method of claim 1 wherein during the depositing of the second layer step, the second layer is deposited such that the top surface of the plurality of second layer valley portions are above the MTJ pillar height.

3. The method of claim 2, wherein after stopping chemical-mechanical polishing step, the method further comprises etching using an IBE process to remove any remaining portion of the plurality of MTJ pillar bumps over the top surface of the MTJ.

4. The method of claim 1 wherein during the depositing of the second layer step, the second layer is deposited such that the top surface of the second layer valley portion is at the MTJ pillar height, thereby allowing exposure of top surfaces of the plurality of MTJ pillars.

5. The method of claim 1, wherein each of the plurality of MTJ pillars includes a reference layer and a free layer separated by a tunneling layer, and a hard mask over the free layer, and wherein during the depositing of the second layer step, the second layer is deposited such that the top surface of second layer valley portion is above a bottom surface of the hard-mask layer of the MTJ pillar.

6. The method of claim 1, further comprising depositing a third layer over the second layer, the third layer being comprised of high CMP rate material, which has a polish rate that is higher than the low CMP rate material, such that a third layer bump portion covers each second layer bump portion, a third layer side portion covers each second layer side portion, and a plurality of third layer valley portions cover the plurality of second layer valley portions, thereby forming the plurality of MTJ pillar bumps with additional height imparted by the third layer bump portion, each of the plurality of MTJ pillar bumps corresponding to the top surface of each of the plurality of MTJ pillars, each of the plurality of MTJ pillar bumps comprising a third layer bump portion, a second layer bump portion and a first layer bump portion.

7. The method of claim 6, wherein the first layer is an insulator material.

8. The method of claim 7, wherein the insulator material is SiOx.

9. The method of claim 6, wherein the second layer is an insulator material.

10. The method of claim 9, wherein the insulator material is SiNx.

11. The method of claim 6, wherein during the depositing of the second layer step, the second layer is deposited such that the top surface of the plurality of second layer valley portions is above the MTJ pillar height.

12. The method of claim 11, wherein after stopping the chemical-mechanical polishing step, the method further comprises etching using an IBE process to remove any remaining portion of the plurality of MTJ pillar bumps over the top surface of the MTJ.

13. The method of claim 1, further comprising depositing an electrode layer prior to the fabricating a plurality of magnetic tunnel junction (MTJ) pillars on a wafer step.

14. The method of claim 1 wherein the high CMP rate material has a CMP rate of seventy nanometers per minute and the low CMP rate material has a CMP rate of two nanometers per second.

15. A method manufacturing a semiconductor device comprising:

fabricating plurality of magnetic tunnel junction (MTJ) pillars on a surface, the surface being on a semiconductor wafer, each of the plurality of MTJ pillars having a top surface and a side surface, the top surface extending at an MTJ pillar height from the surface;

depositing a first layer, the first layer comprising high chemical-mechanical polish (CMP) rate material, such that the first layer covers the top surface of each of the plurality of MTJ pillars, the side surface of each of the plurality of MTJ pillars, and the surface;

depositing a low chemical-mechanical polish (CMP) rate layer over the first layer, thereby forming a plurality of MTJ pillar bumps, each of the plurality of MTJ pillar bumps corresponding to the top surface of each of the plurality of MTJ pillars, the low CMP rate layer further forming a low CMP rate layer valley surface between the plurality of MTJ pillar bumps, each of the plurality of MTJ pillar bumps comprising portions of the first high CMP rate layer and the low CMP rate layer that extend over the top surface of each of the plurality of MTJ pillars, the low CMP rate layer having a thickness selected such that the low CMP rate layer valley surface is at the MTJ pillar height, the low CMP rate material having a lower polish rate than the polish rate of the high CMP rate material;

chemical-mechanical polishing of the semiconductor with a polishing pad to remove the plurality of MTJ pillar bumps;

detecting that the polishing pad has reached the low CMP rate layer valley surface; and

stopping the chemical-mechanical polishing step such that the top surface of each of the MTJ pillars is exposed while the side surface of each of the plurality of MTJ pillars remains covered by high CMP rate layer and the low CMP rate layer.

16. The method of claim 15, wherein the first layer is an insulator material.

17. The method of claim 16, wherein the insulator material is SiOx.

18. The method of claim 15, wherein the low CMP rate layer is an insulator material.

19. The method of claim 18, wherein the insulator material is SiNx.

20. The method of claim 15 wherein the high CMP rate material has a CMP rate of seventy nanometers per minute and the low CMP rate material has a CMP rate of two nanometers per second.