Methods of fabricating micro electro mechanical system structures
First Claim
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1. A method of fabricating a device comprising:
- providing a first substrate structure including a first bonding pad structure having a first bonding material that defines a first bonding surface and a second bonding surface having a recess interposing the first and second bonding surfaces;
providing a second substrate and a second bonding pad structure on the second substrate, wherein the second bonding pad structure includes a second bonding material disposed in a trench recessed from a top surface of the second substrate; and
bonding the first bonding material to the second bonding material such that the first bonding surface bonds to the second bonding material to form a first portion of the bonding interface and the second bonding surface bonds to the second bonding material to form a second portion of the bonding interface, the recess interposing the first and second portions, wherein the first and second portions of the bonding interface are disposed within the trench and wherein at least a portion of the recess extends above the trench.
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Abstract
A method of fabricating a micro electro mechanical system (MEMS) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is provided and bonded with the bonding pad structure of the first substrate structure.
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Citations
20 Claims
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1. A method of fabricating a device comprising:
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providing a first substrate structure including a first bonding pad structure having a first bonding material that defines a first bonding surface and a second bonding surface having a recess interposing the first and second bonding surfaces; providing a second substrate and a second bonding pad structure on the second substrate, wherein the second bonding pad structure includes a second bonding material disposed in a trench recessed from a top surface of the second substrate; and bonding the first bonding material to the second bonding material such that the first bonding surface bonds to the second bonding material to form a first portion of the bonding interface and the second bonding surface bonds to the second bonding material to form a second portion of the bonding interface, the recess interposing the first and second portions, wherein the first and second portions of the bonding interface are disposed within the trench and wherein at least a portion of the recess extends above the trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of fabricating a device comprising:
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providing a first substrate structure having a first bonding material that defines a first bonding surface and a second bonding surface having at least one slot interposing the first and second bonding surfaces; providing a second substrate structure including a second bonding material, wherein the second bonding material disposed in a trench recessed from a top surface of the second substrate; and bonding the first bonding material to the second bonding material such that the first bonding surface bonds to the second bonding material to form a first portion of the bonding interface and the second bonding surface bonds to the second bonding material to form a second portion of the bonding interface, the at least one slot interposing the first and second portions;
where the first and second portions of the bonding interface are disposed within the trench and form bond pad rings. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A method of fabricating a device comprising:
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providing a first substrate having a first bonding material that defines a first bonding surface and a second bonding surface having a slot interposing the first and second bonding surfaces; providing a second substrate including a second bonding material disposed in a trench recessed from a top surface of the second substrate, wherein the second bonding material extends from a first sidewall of the trench to a second sidewall of the trench; and bonding the first bonding material to the second bonding material such that the first bonding surface bonds to the second bonding material to form a first portion of a bonding interface and the second bonding surface bonds to the second bonding material to form a second portion of the bonding interface, the slot interposing the first and second portions, wherein the first and second portions of the bonding interface are disposed within the trench and wherein at least a portion of the slot extends above the trench.
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Specification