Lighting module and method of manufacturing a lighting module

• US 9,777,890 B2
• Filed: 02/27/2013
• Issued: 10/03/2017
• Est. Priority Date: 03/06/2012
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Philips Lighting BV (Koninklijke Philips N.V.)
• Inventors: Hikmet, Rifat Ata Mustafa, van Bommel, Ties, Yu, Jianghong
• Primary Examiner(s): Sawhney, Hargobind S
• Application Number:
  US14/381,240
• Publication Number:
  US 20150103521A1
• Time in Patent Office: 1,679 Days
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21V 19/002 the fastening means engaging the encapsulation or the packaging of the semiconductor device
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A lighting module (150) and a method (100) of manufacturing a lighting module, wherein the method comprises the steps of providing a heat sink material (120) in a fluid state and providing a light-source assembly (110) comprising a plurality of light sources (111) being electrically connected to a carrier (112), wherein each of the light sources has a light-emitting surface (113). The method further comprises the steps of embedding (130) the light-source assembly into the heat sink material such that the carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material, and solidifying (140) the heat sink material.

Claims

1. A method of manufacturing a lighting module, comprising the steps of:

providing a heat sink material in a fluid state;

providing a light-source assembly comprising a plurality of light sources being electrically connected to an electrically conductive carrier, each of the light sources having a light-emitting surface;

pressing the light-source assembly into the heat sink material such that the electrically conductive carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material; and

solidifying the heat sink material.

2. The method as claimed in claim 1, wherein the heat sink material is non-transparent.

3. The method as claimed in claim 1, wherein the heat sink material comprises at least one ceramic material.

4. The method as claimed in claim 3, wherein the at least one ceramic material is chosen from the group consisting of clay, concrete and porcelain.

5. The method as claimed in claim 1, wherein the electrically conductive carrier comprises a wire grid.

6. The method as claimed in claim 1, further comprising the step of applying a phosphor layer on at least one of the light sources.

7. The method as claimed in claim 1, further comprising the step of applying an optical structure on at least one of the light sources.

8. The method as claimed in claim 1, further comprising the step of applying a protective layer on at least one of the light sources.

9. The method as claimed in claim 1, wherein the step of pressing comprises pressing the light-source assembly into the heat sink material in the fluid state by means of a pressing means comprising a base portion and at least one protruding portion which protrudes from the base portion, wherein the at least one protruding portion is arranged to press at least one light source of the plurality of light sources into the heat sink material at the light-emitting surface of the at least one light source to prevent the heat sink material from covering the light-emitting surface of the at least one light source.

10. The method as claimed in claim 9, wherein the heat sink material is shaped by the pressing means upon the pressing of the light-source assembly into the heat sink material to form a cavity around the at least one light source.

11. The method as claimed in claim 1, wherein the step of solidifying comprises the step of polymerizing the heat sink material.

12. The method as claimed claim 1, wherein the step of solidifying comprises the step of heating the heat sink material.

13. A method of manufacturing a lighting module, comprising the steps of:

providing a heat sink material in a fluid state;

providing a light-source assembly comprising a plurality of light sources being electrically connected to an electrically conductive carrier, each of the light sources having a light-emitting surface;

embedding the light-source assembly into the heat sink material such that the electrically conductive carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material; and

solidifying the heat sink material, wherein the step of solidifying comprises the step of pressurizing the heat sink material.