Aided INS microchip assemblies and related methods

• US 9,778,043 B1
• Filed: 03/24/2016
• Issued: 10/03/2017
• Est. Priority Date: 03/25/2015
• Status: Active Grant

• Current Assignee: Inertial Sense, Inc.
• Original Assignee: Inertial Sense, LLC
• Inventors: Johnson, Walter H.
• Primary Examiner(s): Kiswanto, Nicholas
• Assistant Examiner(s): Weber, Tamara
• Application Number:
  US15/080,425
• Time in Patent Office: 558 Days
• Field of Search: None
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01C 21/1654 with electromagnetic compass
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01S 19/13 Receivers
• CPC Class Codes: G01S 19/35 Constructional details or hardware or software details of the signal processing chain
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

Microchip assemblies, such as self-contained, aided, INS microchip assemblies configured for being coupled with a circuit board or another electrical component. In some embodiments, two inertial navigation sensors may be provided, along with a receiver configured to receive an external signal comprising location data or another aiding sensor, such as a barometric pressure sensor, magnetometer, or WIFI receiver. The assembly may further comprise a processor configured to receive inertial parameter data from inertial navigation sensors and location data from the receiver, and may be configured to process the inertial parameter data and location data to output inertial navigation information.

Claims

1. A microchip assembly comprising a plurality of die pieces formed into a single semiconductor package, comprising:

a first inertial navigation sensor configured to sense one or more inertial parameters;

a second inertial navigation sensor configured to sense one or more inertial parameters;

a receiver configured to receive an external signal comprising location data;

a processor, wherein the processor is configured to receive inertial parameter data from the first inertial navigation sensor, inertial parameter data from the second inertial navigation sensor, and location data from the receiver, and wherein the processor is configured to process the inertial parameter data and location data to output inertial navigation information; and

an encapsulation material encapsulating the first inertial navigation sensor, the second inertial navigation sensor, the receiver, and the processor together in a single package.

2. The microchip assembly of claim 1, wherein the first inertial navigation sensor comprises an accelerometer, and wherein the second inertial navigation sensor comprises a gyroscope.

3. The microchip assembly of claim 1, further comprising an aiding sensor configured to generate inertial navigation data to augment data from the first inertial navigation sensor, data from the second inertial navigation sensor, and the location data, wherein the processor is further configured to receive inertial navigation data from the aiding sensor and to use the inertial navigation data from the aiding sensor to generate the inertial navigation information.

4. The microchip assembly of claim 3, wherein the aiding sensor is configured to correct for inaccuracies in the inertial navigation information resulting from use of data from the first inertial navigation sensor, data from the second inertial navigation sensor, and the location data without the aiding sensor.

5. The microchip assembly of claim 3, wherein the aiding sensor comprises at least one of a magnetometer and a barometric pressure sensor.

6. The microchip assembly of claim 1, wherein the receiver comprises at least one of a GPS receiver and a GNSS receiver.

7. The microchip assembly of claim 1, wherein the microchip assembly comprises a stacked assembly.

8. An integrated circuit assembly, comprising:

at least one of an absolute positional sensor and an aiding positional sensor for receiving positional information for detecting an absolute position of a device incorporating the integrated circuit assembly;

at least one motional inertial navigation sensor configured to sense one or more inertial parameters comprising at least one of velocity, acceleration, and orientation; and

an onboard processor configured to receive inertial parameter data from the at least one motional inertial navigation sensor, wherein the onboard processor is further configured to receive positional data from the at least one of an absolute positional sensor and an aiding positional sensor, wherein the onboard processor is further configured to process the inertial parameter data and the positional data to output inertial navigation information, wherein the inertial navigation information comprises absolute positional data and relativistic motion data, wherein the integrated circuit assembly is configured to be coupled to a separate circuit board, and wherein the integrated circuit assembly lacks a circuit board.

9. The integrated circuit assembly of claim 8, wherein the at least one motional inertial navigation sensor comprises a gyroscope.

10. The integrated circuit assembly of claim 9, wherein the at least one motional inertial navigation sensor further comprises an accelerometer.

11. The integrated circuit assembly of claim 8, wherein the at least one of an absolute positional sensor and an aiding positional sensor comprises an absolute positional sensor comprising at least one of a GPS receiver and a GNSS receiver, and wherein the absolute positional sensor is configured to receive an external signal comprising location data, and wherein the onboard processor is configured to combine the location data with the inertial parameter data to generate the inertial navigation information.

12. The integrated circuit assembly of claim 11, wherein the at least one of an absolute positional sensor and an aiding positional sensor further comprises an aiding positional sensor, and wherein the aiding positional sensor comprises at least one of a barometric pressure sensor, a magnetometer, and a WIFI receiver.

13. A microchip assembly comprising a plurality of die pieces formed into a single semiconductor package, comprising:

a gyroscope configured to generate a first set of inertial navigation data;

an accelerometer configured to generate a second set of inertial navigation data;

an aiding sensor configured to generate a third set of inertial navigation data to augment the first set of inertial navigation data and the second set of inertial navigation data; and

a processor, wherein the processor is configured to receive the first set of inertial navigation data from the gyroscope, the second set of inertial navigation data from the accelerometer, and the third set of inertial navigation data from the aiding sensor, wherein the processor is configured to process the first set of inertial navigation data, the second set of inertial navigation data, and third set of inertial navigation data to output inertial navigation information, and wherein the microchip assembly comprises a stacked assembly comprising the gyroscope, the accelerometer, the aiding sensor, and the processor together in a single package.

14. The microchip assembly of claim 13, wherein the aiding sensor comprises an absolute positional sensor.

15. The microchip assembly of claim 14, wherein the absolute positional sensor comprises a receiver configured to receive an external signal comprising location data.

16. The microchip assembly of claim 13, wherein the aiding sensor comprises at least one of a barometric pressure sensor, a magnetometer, and a WIFI receiver.

17. The microchip assembly of claim 13, wherein each of the gyroscope, the accelerometer, the aiding sensor, and the processor is in a stacked configuration with respect to one another.

18. The microchip assembly of claim 13, further comprising a plurality of leads configured to electrically couple the microchip assembly with a circuit board, wherein the microchip assembly lacks a circuit board.