Module for detecting a vibrational behavior of a mechanical component

• US 9,778,146 B2
• Filed: 03/30/2015
• Issued: 10/03/2017
• Est. Priority Date: 03/31/2014
• Status: Active Grant

• Current Assignee: ABet SKF
• Original Assignee: ABet SKF
• Inventors: Biegner, Johannes, Graf, Jens, Verhulst, Laurens
• Primary Examiner(s): Surin, J M Saint
• Application Number:
  US14/672,980
• Publication Number:
  US 20150276556A1
• Time in Patent Office: 918 Days
• Field of Search: 73584
• CPC Class Codes: B60C 23/003 comprising rotational joints between vehicle-mounted pressure sources and the tyres
• CPC Class Codes: G01L 17/005 using a sensor contacting the exterior surface, e.g. for measuring deformation
• CPC Class Codes: G01M 17/025 using infrasonic, sonic or ultrasonic vibrations
• CPC Class Codes: G08B 21/182 Level alarms, e.g. alarms responsive to variables exceeding a threshold

Abstract

A module for detecting a vibrational behavior of a mechanical component includes an attachment component configured to be rigidly mechanically connected to the mechanical component in order to absorb a mechanical vibration of the mechanical component, a circuit board including a circuit, the circuit board being configured to detect the mechanical vibration of the mechanical component and, based on the detected vibration, to wirelessly transmit a signal indicative of the vibrational behavior, and at least one spacer mechanically connecting the circuit board to the attachment component such that the mechanical vibration is transferable from the attachment component to the circuit board.

Claims

1. A module for detecting a vibrational behavior of a mechanical component, the module comprising:

an attachment component configured to be rigidly mechanically connected to the mechanical component in order to absorb a mechanical vibration of the mechanical component;

a circuit board including a circuit, the circuit board being configured to detect the mechanical vibration of the mechanical component and, based on the detected vibration, to wirelessly transmit a signal indicative of the vibrational behavior;

wherein the circuit board and the attachment component are oriented lengthwise along a parallel direction, wherein the circuit board is disposed relative to the attachment component along a direction perpendicular to the direction of orientation and

at least one spacer mechanically connecting the circuit board to the attachment component such that the mechanical vibration is transferable from the attachment component to the circuit board.

2. The module according to claim 1, wherein the wireless transmission of the signal is a radio transmission.

3. The module according to claim 1, wherein the at least one spacer is configured to rigidly connect and fix the circuit board to the attachment component.

4. The module according to claim 1, wherein the at least one spacer is formed from a metallic material.

5. The module according to claim 1, wherein the at least one spacer comprises a support surface on which the circuit board rests, and a screw element attached to the circuit board on a side facing away from the support surface.

6. The module according to claim 1, wherein the at least one spacer is screwed to the attachment component.

7. The module according to claim 1, further including an additional component disposed between the circuit board and the attachment component, and wherein in a projection of the additional component onto the circuit board, along a projection direction perpendicular to the circuit board, at least 30% of a total surface of the projection of the additional component is at least partially produced from electrically conductive material, and wherein the total surface of the projection of the additional component corresponds to at least 30% of the total surface of a projection of the circuit board along the projection direction.

8. The module according to claim 1, further comprising an energy source disposed between the circuit board and the attachment component, the energy source being coupled to the circuit of the circuit board in order to supply the circuit with electrical energy.

9. The module according to claim 1, wherein the attachment component is formed from an electrically conductive material.

10. The module according to claim 1, wherein the circuit comprises an antenna configured to transmit the signal indicative of the vibrational behavior.

11. The module according to claim 1, wherein the at least one spacer is a separate component.

12. The module according to claim 1, wherein the attachment component is a metal-plate part.

13. The module according to claim 1, wherein the mechanical component is a rim of a wheel, a wheel support for the wheel, or a valve of a tire of the wheel.

14. The module according to claim 1, further comprising an energy source disposed between the circuit board and the attachment component, the energy source being coupled to the circuit of the circuit board in order to supply the circuit with electrical energy and wherein the circuit comprises an antenna configured to transmit the signal indicative of the vibrational behavior, and

wherein the wireless transmission of the signal is a radio transmission,

wherein the at least one spacer rigidly connects and fixes the circuit board to the attachment component, and is formed from a metallic material,

wherein the at least one spacer comprises a support surface on which the circuit board rests, and a screw element attached to the circuit board on a side facing away from the support surface,

wherein the attachment component is formed from an electrically conductive material,

wherein the at least one spacer is a separate component and includes a metal-plate part.

15. The module according to claim 14, further including an additional component disposed between the circuit board and the attachment component, and wherein in a projection of the additional component onto the circuit board, along a projection direction perpendicular to the circuit board, at least 30% of a total surface of the projection of the additional component is at least partially produced from electrically conductive material, and wherein the total surface of the projection of the additional component corresponds to at least 30% of the total surface of a projection of the circuit board along the projection direction.

16. A module for detecting a vibrational behavior of a mechanical component, the module comprising:

a base configured to be rigidly mechanically connected to the mechanical component in order to receive a mechanical vibration of the mechanical component;

a circuit board including a circuit, the circuit board being configured to detect the mechanical vibration of the mechanical component and, based on the detected vibration, to wirelessly transmit a signal indicative of the vibrational behavior;

wherein the circuit board and the base are oriented lengthwise along a parallel direction, wherein the circuit board is disposed relative to the base along a direction perpendicular to the direction of orientation and

at least one spacer mechanically connecting the circuit board to the attachment component such that the mechanical vibration is transferable from the attachment component to the circuit board.

17. The module according to claim 16, wherein the at least one spacer comprises a support plate to which the circuit board is mounted and a screw rigidly connecting the support plate to the base.

18. The module according to claim 16, further including an additional component disposed between the circuit board and the attachment component, and wherein in a projection of the additional component onto the circuit board, along a projection direction perpendicular to the circuit board, at least 30% of a total surface of the projection of the additional component is at least partially produced from electrically conductive material, and wherein the total surface of the projection of the additional component corresponds to at least 30% of the total surface of a projection of the circuit board along the projection direction.