Inertial force sensor

• US 9,778,279 B2
• Filed: 08/13/2014
• Issued: 10/03/2017
• Est. Priority Date: 09/03/2007
• Status: Expired due to Fees

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Ohkoshi, Hideo, Mitani, Tomohiro
• Primary Examiner(s): Kwok, Helen
• Application Number:
  US14/459,097
• Publication Number:
  US 20140352430A1
• Time in Patent Office: 1,147 Days
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: G01C 19/5607 using vibrating tuning forks double-ended tuning forks using planar vibrating masses suspended at opposite ends G01C19/5719
• CPC Class Codes: G01P 1/003 used for damping
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Claims

1. A sensor comprising:

a sensing element having an electrode pad at the sensing element wherein the sensing element has a first member having the electrode pad at an upper surface of the first member and a second member on the first member, and a side surface of the first member and a side surface of the second member lie in the same plane at a portion connecting the first member and the second member, the first member having a first side, the electrode pad being disposed at only the first side of the first member;

an IC comprising a first side, a second side, a third side, and a fourth side on a plane surface, the IC having pads aligned at the first side of the IC and pads aligned at the second side of the IC, the first side being opposite to the second side, the first side of the IC being positioned at the first side of the first member; and

a package having a pad at the package,

wherein the electrode pad at the first member of the sensing element is electrically connected to at least one of the pads at the first side of the IC via a first wire,

at least one of the pads at the second side of the IC is electrically connected to the pad at the package via a second wire,

wherein the second member of the sensing element is stacked above the first member of the sensing element, and the first member of the sensing element is stacked above the IC,

wherein the upper surface of the first member is positioned lower than an upper surface of the second member, and

wherein the electrode pad at the first member is not covered by the second member.

2. The sensor of claim 1, wherein

the electrode pad at the sensing element is positioned higher than the pads at the first side of the IC and the pads at the second side of the IC, and

the pads at the first side of the IC and the pads at the second side of the IC are positioned higher than the pad at the package.

3. The sensor of claim 1, wherein

the sensing element is an angular velocity sensing element.

4. The sensor of claim 1, wherein

the sensing element is in contact with the IC.

5. The sensor of claim 1, wherein

the electrode pad at the sensing element is directly connected to at least one of the pads at the first side of the IC via the first wire.

6. The sensor of claim 1, wherein

all of the pads at the first side of the IC are aligned straight on a first single imaginary straight line parallel to the first side of the IC,

all of the pads at the second side of the IC are aligned straight on a second single imaginary straight line parallel to the second side of the IC,

the IC has the third side perpendicular to the first side of the IC and the fourth side opposite to the third side, and

no pads are presented in both of the third side and the fourth side of the IC.

7. The sensor of claim 1, wherein

the portion connecting the first member and the second member of the sensing element is positioned at the third side of the IC, and

the third side is perpendicular to the first side of the IC.

8. The sensor of claim 1, wherein

an area of the upper surface of the first member is larger than an area of the upper surface of the second member in plan view.

9. The sensor of claim 1, wherein

the upper surface of the second member does not have a hole.

10. The sensor of claim 1, wherein

the first member contacts the second member.