Method of producing a transponder and a transponder

• US 9,779,349 B2
• Filed: 01/28/2015
• Issued: 10/03/2017
• Est. Priority Date: 11/28/2005
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Rogy, Reinhard, Zenz, Christian
• Primary Examiner(s): Gudorf, Laura
• Application Number:
  US14/607,517
• Publication Number:
  US 20150144704A1
• Time in Patent Office: 979 Days
• Field of Search: 235492, 340 101
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/30105 Capacitance
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

Claims

1. A transponder comprising:

a substrate which comprises a first area, a second area adjacent to said first area, and a first surface electrical contact attached on said substrate adjacent to said second area, and a third area adjacent to said first area, and a second surface electrical contact attached on said substrate adjacent to said third area, each of the second area and the first surface electrical contact being adjacent to neither the third area nor the second surface electrical contact;

a conditioned said substrate such that said first area has a first wettability, said second area has a second wettability and said third area has a third wettability, said first wettability being lower than said second and said third wettability;

an electrical device in or on said first area, wherein said electrical device has a lower surface, an upper surface and a plurality of side surfaces, at least one of which comprises electrical contacts; and

a conductive glue on said second and third areas and/or on said first surface electrical contact and said second surface electrical contact so that said conductive glue automatically centers the electrical device and electrically couples said first and said second surface electrical contacts with to said electrical contacts of said electrical device.

2. The transponder as recited in claim 1, wherein said electrical device is in or on said first area without touching said first surface electrical contact.

3. The transponder as recited in claim 1, comprising cured conductive glue said cured conductive glue not pressing said electric device on said substrate.

4. The transponder as recited in claim 1, comprising said electrical device placed in or on said first area and at least partly on said second area.

5. The transponder as recited in claim 1, comprising said electrical device placed in or on said first area such that said side surface comprising said electrical contact faces toward said first surface electrical contact.

6. The transponder as recited in claim 1, wherein at least said side surface faces toward said first surface electrical contact is inclined with respect to said bottom surface of said electrical device.

7. The transponder as recited in claim 5, comprising said conductive glue applied at least partly on said electrical device.

8. The transponder as recited in claim 1, wherein said substrate has an antenna attached thereon, and said antenna comprises at least one antenna end being represented by said first surface electrical contact.

9. The transponder as recited in claim 1, wherein said substrate is a first substrate, said transponder further comprising:

said first substrate mounted on a second substrate on which an antenna with at least one antenna end is attached; and

said first surface in electrical contact with said at least one antenna end.