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High efficiency on-chip 3D transformer structure

  • US 9,779,869 B2
  • Filed: 07/25/2013
  • Issued: 10/03/2017
  • Est. Priority Date: 07/25/2013
  • Status: Active Grant
First Claim
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1. A multi-planar integrated circuit transformer structure, comprising:

  • at least two interleaved conductor coils stacked in parallel in at least two different layers, having a first conductor coil, including;

    a first coil turn within each of the at least two different layers having a same first radius, where the first coil turn within each of the at least two different layers are directly connected together electrically and are spatially arranged in parallel; and

    a second coil turn within each of the at least two different layers having a same second radius, where the second coil turn within each of the at least two different layers are directly connected together electrically and are spatially arranged in parallel, such that the first coil turn and second coil turn in a same one of each of the different layers are concentric, and wherein the first and second coil turns are electrically connected; and

    a second conductor coil including;

    a third coil turn within each of the at least two different layers having a same third radius, where the third coil turn in each of the at least two different layers are directly connected together electrically and are spatially arranged in parallel, where the third coil turn in each of the at least two different layers is in a same plane between the first coil and second coil turns, wherein the first radius, second radius and third radius are different, such that the first, second, and third coil turns form three concentric inductors.

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