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Method for making EMI shielding layer on a package

  • US 9,780,041 B1
  • Filed: 09/13/2016
  • Issued: 10/03/2017
  • Est. Priority Date: 05/25/2016
  • Status: Active Grant
First Claim
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1. A method for making EMI shielding layer on a package, comprising the steps of:

  • a) disposing a UV curable adhesive on a light-transmissive substrate;

    b) placing said package on said UV curable adhesive in such a way that said UV curable adhesive adheres to a surface of said package having solder pads to cover the solder pads;

    c) irradiating UV light toward said light-transmissive substrate to cure said UV curable adhesive;

    d) forming an EMI shielding layer on said package; and

    e) thermally releasing said UV curable adhesive by placing the package in a high temperature liquid to thermal release the UV curable adhesive,wherein said high temperature liquid has a temperature higher than 170°

    C.

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