Method for making EMI shielding layer on a package

• US 9,780,041 B1
• Filed: 09/13/2016
• Issued: 10/03/2017
• Est. Priority Date: 05/25/2016
• Status: Active Grant

• Current Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chien, Pioneer
• Primary Examiner(s): Rizkallah, Kimberly
• Assistant Examiner(s): Ligai, Maria
• Application Number:
  US15/263,711
• Time in Patent Office: 385 Days
• CPC Class Codes: H01L 21/2855 by physical means, e.g. sputtering, evaporation H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/32051 Deposition of metallic or metal-silicide layers
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA

Abstract

A method for making EMI shielding layer on a package is disclosed to include the steps of: a) disposing a UV curable adhesive which can be thermally released on a light-transmissive substrate; b) placing the package on the UV curable adhesive in such a way that the UV curable adhesive adheres to and cover a surface of the package having solder pads; c) irradiating UV light toward the light-transmissive substrate to cure the UV curable adhesive; d) forming an EMI shielding layer on the package; and e) thermally releasing the UV curable adhesive.

Claims

1. A method for making EMI shielding layer on a package, comprising the steps of:

a) disposing a UV curable adhesive on a light-transmissive substrate;

b) placing said package on said UV curable adhesive in such a way that said UV curable adhesive adheres to a surface of said package having solder pads to cover the solder pads;

c) irradiating UV light toward said light-transmissive substrate to cure said UV curable adhesive;

d) forming an EMI shielding layer on said package; and

e) thermally releasing said UV curable adhesive by placing the package in a high temperature liquid to thermal release the UV curable adhesive,

wherein said high temperature liquid has a temperature higher than 170°

C.

2. The method as claimed in claim 1, wherein in step d), the EMI shielding layer is formed by a sputtering process, and said UV curable adhesive is thermally released at a temperature higher than a temperature in said sputtering process.

3. The method as claimed in claim 2, wherein in step a), said light-transmissive substrate is a light-transmissive glass.

4. The method as claimed in claim 2, wherein, in step a), said UV curable adhesive disposed on said light-transmissive substrate has a thickness of 100 μ

m.

5. The method as claimed in claim 1, wherein in step a), said light-transmissive substrate is a light-transmissive glass.

6. The method as claimed in claim 1, wherein, in step a), said UV curable adhesive disposed on said light-transmissive substrate has a thickness of 100 μ

m.

7. The method as claimed in claim 1, wherein, in Step b), said UV curable adhesive is adhered to a lateral side surface near a bottom of said package.

8. The method as claimed in claim 7, wherein, in Step b), said UV curable adhesive is adhered to said lateral side surface in a height of 30 μ

m from the bottom of said package.

9. The method as claimed in claim 1, further comprising a sub step of performing a singulating process to a package strip that having a plurality of said packages to form a plurality of said packages prior to step b).

10. The method as claimed in any of claim 1, wherein a clearance is left between said bottom surface of said package and said EMI shielding layer.