Transient electronic device with ion-exchanged glass treated interposer
First Claim
1. A transient electronic device comprising:
- an integrated circuit (IC) die including a semiconductor substrate having an electronic circuit formed thereon, and IC contact pads disposed in a first pattern on a surface of the semiconductor substrate, said IC contact pads being operably coupled to said electronic circuit;
a package structure including a package substrate, a plurality of first package contact structures disposed in a second pattern on a first surface thereof, a plurality of second package contact structures disposed on a second surface thereof, and a plurality of package conductors extending through the package structure between the first and second surfaces such that each said package conductor forms an electrical path between an associated first package contact structure and an associated second package contact structure;
an interposer comprising a glass substrate including a plurality of first contact points disposed in the first pattern on a first surface thereof, a plurality of second contact points disposed on a second surface thereof, and a plurality of interposer conductors, each said interposer conductor being configured to form an electrical path between an associated first contact point and an associated second contact point; and
a trigger device attached to the interposer and configured to generate and apply an initial fracture force on said glass substrate in response to a trigger signal,wherein the interposer is secured to the package substrate such that each of the second contact points disposed on the second surface are electrically connected to corresponding first package contact structures,wherein the glass substrate contains an amount of ions such that secondary fractures are generated in said glass substrate in response to said initial fracture force and propagate throughout said glass substrate, whereby said glass substrate is powderized, andwherein the IC die is fixedly attached to the glass substrate such that the secondary fractures propagate into said IC die with sufficient energy to powderize said IC die.
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Accused Products
Abstract
A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).
42 Citations
11 Claims
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1. A transient electronic device comprising:
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an integrated circuit (IC) die including a semiconductor substrate having an electronic circuit formed thereon, and IC contact pads disposed in a first pattern on a surface of the semiconductor substrate, said IC contact pads being operably coupled to said electronic circuit; a package structure including a package substrate, a plurality of first package contact structures disposed in a second pattern on a first surface thereof, a plurality of second package contact structures disposed on a second surface thereof, and a plurality of package conductors extending through the package structure between the first and second surfaces such that each said package conductor forms an electrical path between an associated first package contact structure and an associated second package contact structure; an interposer comprising a glass substrate including a plurality of first contact points disposed in the first pattern on a first surface thereof, a plurality of second contact points disposed on a second surface thereof, and a plurality of interposer conductors, each said interposer conductor being configured to form an electrical path between an associated first contact point and an associated second contact point; and a trigger device attached to the interposer and configured to generate and apply an initial fracture force on said glass substrate in response to a trigger signal, wherein the interposer is secured to the package substrate such that each of the second contact points disposed on the second surface are electrically connected to corresponding first package contact structures, wherein the glass substrate contains an amount of ions such that secondary fractures are generated in said glass substrate in response to said initial fracture force and propagate throughout said glass substrate, whereby said glass substrate is powderized, and wherein the IC die is fixedly attached to the glass substrate such that the secondary fractures propagate into said IC die with sufficient energy to powderize said IC die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification