Memory cell pillar including source junction plug
First Claim
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1. An apparatus comprising:
- a source material;
a dielectric material over the source material, the dielectric material including an opening, the opening including a recess, the recess including a first recess sidewall and a second recess sidewall opposite from the first recess sidewall;
a select gate material over the dielectric material, the select gate material including an opening having a first side wall and a second sidewall opposite from the first sidewall;
a memory cell stack over the select gate material;
a conductive plug located in the opening including the recess of the dielectric material and contacting a portion of the source material, the conductive plug including an epitaxial material;
a channel material extending through the memory cell stack and through the select gate material between the first and second sidewalls of the select gate material and contacting the conductive plug, wherein a distance between the first and second recess sidewalk is greater than a distance between the first and second sidewalls of the opening of the select gate material; and
a metal combined with a semiconductor material, wherein the source material is between the dielectric material and the metal combined with the semiconductor material.
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Abstract
Some embodiments include apparatuses and methods having a source material, a dielectric material over the source material, a select gate material over the dielectric material, a memory cell stack over the select gate material, a conductive plug located in an opening of the dielectric material and contacting a portion of the source material, and a channel material extending through the memory cell stack and the select gate material and contacting the conductive plug.
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Citations
31 Claims
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1. An apparatus comprising:
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a source material; a dielectric material over the source material, the dielectric material including an opening, the opening including a recess, the recess including a first recess sidewall and a second recess sidewall opposite from the first recess sidewall; a select gate material over the dielectric material, the select gate material including an opening having a first side wall and a second sidewall opposite from the first sidewall; a memory cell stack over the select gate material; a conductive plug located in the opening including the recess of the dielectric material and contacting a portion of the source material, the conductive plug including an epitaxial material; a channel material extending through the memory cell stack and through the select gate material between the first and second sidewalls of the select gate material and contacting the conductive plug, wherein a distance between the first and second recess sidewalk is greater than a distance between the first and second sidewalls of the opening of the select gate material; and a metal combined with a semiconductor material, wherein the source material is between the dielectric material and the metal combined with the semiconductor material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11)
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10. An apparatus comprising:
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a source material; a dielectric material over the source material, the dielectric material including an opening; a select gate material over the dielectric material; a memory cell stack over the select gate material; a conductive plug located in the opening of the dielectric material and contacting a portion of the source material; a channel material extending through the memory cell stack and the select gate material and contacting the conductive plug; and a transition metal combined with a semiconductor material, wherein the source material is between the dielectric material and the transition metal combined with the semiconductor material.
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12. An apparatus comprising:
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a source material; a first dielectric material over the source material, the first dielectric material including a dielectric constant greater than a dielectric constant of silicon dioxide; a source-side select (SGS) gate material over the first dielectric material; levels of memory cells over the SGS select gate material; a cell pillar extending through the levels of memory cells, the SGS gate material, and the first dielectric material, the cell pillar including a conductive plug contacting the source material, the conductive plug including an epitaxial material, a channel material contacting the conductive plug, and a second dielectric material surrounded by at least a portion of the channel material; and a metal combined with a semiconductor material, wherein the source material is between the dielectric material and the metal combined with the semiconductor material. - View Dependent Claims (13, 14, 15)
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16. An apparatus comprising:
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a source material; a first dielectric material over the source material, the first dielectric material including a dielectric constant greater than a dielectric constant of silicon dioxide; a source-side select (SGS) gate material over the first dielectric material; levels of memory cells over the SGS select gate material; a cell pillar extending through the levels of memory cells, the SGS gate material, and the first dielectric material, the cell pillar including a conductive plug contacting the source material, a channel material contacting the conductive plug, and a second dielectric material surrounded by at least a portion of the channel material; and a substrate and a silicide material between the substrate and the source material.
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17. A method comprising:
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forming a source material; forming a dielectric material over the source material; forming a source-side select (SGS) gate material over the dielectric material; forming alternating levels of materials over the SGS gate material; forming a first portion of a cell pillar, the first portion of the cell pillar contacting the source material and located between the alternating levels of materials and the source material, wherein forming the first portion of the cell pillar includes growing an epitaxial material from a portion of the source material, such that the epitaxial material is part of the first portion of the cell pillar; forming a second portion of the cell pillar after the first portion of the cell pillar is formed, the second portion of the cell pillar contacting the first portion of the cell pillar and extending through the alternating levels of materials; and forming a metal combined with a semiconductor material, wherein the source material is between the dielectric material and the metal combined with the semiconductor material. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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24. A method comprising:
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forming a source material; forming a dielectric material over the source material; forming a select gate material over the dielectric material; forming alternating levels of materials over the select gate material; forming an opening through the alternating levels of materials, the select gate material, and the dielectric material, such that a portion of the source material is exposed through the opening; forming a conductive plug contacting the portion of the source material that is exposed through the opening; and forming a channel material extending through the alternating levels of materials and the select gate material and contacting the conductive plug, wherein forming the conductive plug includes growing an epitaxial material from the portion of the source material, such that the epitaxial material is part of the conductive plug. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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Specification