One up, one down connection structure for piezoelectric device in tire patch

• US 9,780,287 B2
• Filed: 11/15/2012
• Issued: 10/03/2017
• Est. Priority Date: 11/15/2012
• Status: Active Grant

• Current Assignee: Compagnie générale des établissements Michelin
• Original Assignee: Compagnie générale des établissements Michelin
• Inventors: Weston, David Alan, Hodgkinson, Raymond Leslie
• Primary Examiner(s): Dougherty, Thomas
• Application Number:
  US14/417,346
• Publication Number:
  US 20150249198A1
• Time in Patent Office: 1,783 Days
• Field of Search: 310311-371, 310 40, 310344, 310365, 310366, 29 2535
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 31/02 relating to soldering or welding dip or wave soldering in the manufacture of printed circuits H05K3/34
• CPC Class Codes: B29C 73/10 using patches sealing on the surface of the article B29C73/14 takes precedence
• CPC Class Codes: B29L 2030/00 Pneumatic or solid tyres or parts thereof conveyor belts B29L2031/7092; drive belts B29L2031/7094; fourdrinier belts B29L2031/733
• CPC Class Codes: B60C 19/00 Tyre parts or constructions not otherwise provided for
• CPC Class Codes: B60C 23/0411 Piezoelectric generators
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: B60C 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2203/04 Soldering or other types of metallurgic bonding using molten metal H05K2203/128
• CPC Class Codes: H05K 2203/1194 Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
• CPC Class Codes: H05K 3/34 by soldering
• CPC Class Codes: H10N 30/063 Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/87 Electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A conductive terminal structure for a piezoelectric device used as part of a tire mountable apparatus is provided. Unlike known electrical connection structures which include a plurality of conductive terminals that are all exposed through a single insulating layer of the piezoelectric device, such as a top layer of the piezoelectric device, the electrical connection structure can be arranged in a one up, one down configuration. In this configuration, at least one conductive terminal is exposed through a top insulating layer of the piezoelectric device. In addition, at least one conductive terminal of a piezoelectric component is exposed through a bottom insulating layer of the piezoelectric device. The electrical connection structure can be used in combination with a connector assembly design to preserve the integrity of the electrical connection between the electrical and mechanical connection structure and a printed circuit board.

Claims

1. A tire mountable apparatus comprising a substrate, the substrate comprising:

a first piezoelectric component arranged between a first insulating layer of the substrate and a second insulating layer of the substrate, the first piezoelectric component comprising first and second conductive layers and a first piezoelectric layer arranged between the first and second conductive layers;

a conductive terminal structure, the conductive terminal structure comprising a plurality of conductive terminals, the plurality of conductive terminals comprising a first conductive terminal electrically coupled to the first conductive layer and a second conductive terminal electrically coupled to the second conductive layer;

wherein the first conductive terminal is exposed through the first insulating layer of the substrate, the second conductive terminal is exposed through the second insulating layer of the substrate, and the first conductive terminal and the second conductive terminal are alternately exposed with respect to each other.

2. The tire mountable apparatus of claim 1, wherein the first conductive terminal comprises a first solder well formed in the first insulating layer and the second conductive terminal comprises a second solder well formed in the second insulating layer.

3. The tire mountable apparatus of claim 1, wherein the substrate comprises a second piezoelectric component arranged between the first insulating layer and the second insulating layer, the second piezoelectric component comprising third and fourth conductive layers and a second piezoelectric layer arranged between the third and fourth conductive layers.

4. The tire mountable apparatus of claim 3, wherein the plurality of conductive terminals comprises a third conductive terminal electrically coupled to the third conductive layer and a fourth conductive terminal electrically coupled to the fourth conductive layer, the third conductive terminal exposed through the first insulating layer of the substrate and the fourth conductive terminal exposed through the second insulating layer of the substrate, the third conductive terminal and the second conductive terminal alternately exposed with respect to each other.

5. The tire mountable apparatus of claim 4, wherein the plurality of conductive terminals are arranged in a generally linear relationship.

6. The tire mountable apparatus of claim 4, wherein the third conductive terminal comprises a third solder well formed in the first insulating layer and the fourth conductive terminal comprises a fourth solder well formed in the second insulating layer.

7. The tire mountable apparatus of claim 1, wherein the plurality of conductive terminals each comprise a conductive annulus.

8. The tire mountable apparatus of claim 1, wherein the first and second insulating layers are formed from FR4.

9. The tire mountable apparatus of claim 1, wherein the tire mountable apparatus further comprises an elastomeric layer having a base portion and a mesa portion, the substrate being secured to the mesa portion of the elastomeric layer.

10. The tire mountable apparatus of claim 1, wherein the tire mountable apparatus comprises a first support bar and a second support bar, the plurality of conductive terminals being arranged between the first support bar and the second support bar.

11. The tire mountable apparatus of claim 10, wherein the tire mountable apparatus further comprises a printed circuit board electrically and mechanically coupled to the plurality of conductive terminals.

12. The tire mountable apparatus of claim 11, wherein the printed circuit board is coupled to the piezoelectric component through the first and second conductive terminals using a plurality of conductive posts, each of the plurality of conductive posts extending from the first support bar and through one of the first and second conductive terminals, each of the plurality of conductive posts further extending through the second conductive element and being operably connected to the printed circuit board so as to provide an electrical connection between the printed circuit board and one of the first and second conductive terminals and so as to provide mechanical support for the printed circuit board.

13. The tire mountable apparatus of claim 11, wherein the printed circuit board is coupled to the second piezoelectric component through a plurality of electrical connectors, each of the plurality of electrical connectors extending through the second support bar and contacting one of the third conductive terminal or the fourth conductive terminal so as to provide an electrical connection between the printed circuit board and one of the third and fourth conductive terminals.

14. The tire mountable apparatus of claim 1, wherein the first insulating layer and the second insulating layer have different thicknesses.

15. A method of manufacturing a tire mountable apparatus, comprising:

aligning a first support bar with a plurality of conductive terminals formed in a substrate, the substrate comprising a piezoelectric component arranged between a first insulating layer and a second insulating layer, the piezoelectric component comprising first and second conductive layers and a piezoelectric layer arranged between the first and second conductive layers, the plurality of conductive terminals comprising a first conductive terminal and a second conductive terminal, the first conductive terminal electrically coupled to the first conductive layer and exposed through the first insulating layer of the substrate, the second conductive terminal electrically coupled to the second conductive layer and exposed through the second insulating layer of the substrate, the first conductive terminal and the second conductive terminal alternately exposed with respect to each other;

providing solder in a second solder well formed in the second insulating layer of the substrate, the second solder well associated with the second conductive terminal; and

soldering an electrical connector located in the first support bar with the second conductive terminal.

16. The method of claim 15, wherein the method further comprises curing the substrate to an elastomeric member, the elastomeric member comprising a base portion and a mesa portion, the substrate being secured to the mesa portion of the elastomeric member such that the first support bar is embedded in the elastomeric member.

17. The method of claim 15, wherein the method further comprises:

providing solder in a first solder well formed in the first insulating layer of the substrate, the first solder well associated with the first conductive terminal; and

soldering an electrical connector with the first conductive terminal.

18. The method of claim 17, wherein the method further comprises:

securing a first conductive post to the electrical connector soldered to the first conductive terminal; and

securing a second conductive post to the electrical connector soldered to the second conductive terminal.

19. The method of claim 18, wherein the method comprises positioning a second support bar over the plurality of conductive terminals such that the first and second conductive posts extend through the second support bar.

20. The method of claim 19, wherein the method comprises securing a printed circuit board to the first and second conductive posts such that the printed circuit board is electrically connected to the first and second conductive terminals and such that the printed circuit board is mechanically supported by the first and second conductive posts.