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Structured lamination transfer films and methods

  • US 9,780,335 B2
  • Filed: 07/20/2012
  • Issued: 10/03/2017
  • Est. Priority Date: 07/20/2012
  • Status: Active Grant
First Claim
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1. A lamination transfer film for use in transferring an embedded structured layer, comprising:

  • a carrier substrate having a releasable surface;

    a sacrificial releasable layer having a first surface applied to the releasable surface of the carrier substrate and having a second surface opposite the first surface;

    a top layer applied to the second surface of the sacrificial releasable layer and having a non-planar structured surface on a side of the top layer opposite the sacrificial releasable layer; and

    a backfill layer applied to the non-planar structured surface of the top layer, forming a structured interface between the top layer and the backfill layer,wherein the sacrificial releasable layer is capable of being removed from the top layer while leaving the backfill layer and the top layer substantially intact.

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