Transferable transparent conductive patterns and display stack materials

• US 9,782,955 B2
• Filed: 08/13/2014
• Issued: 10/10/2017
• Est. Priority Date: 09/24/2013
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Dolezal, Michael W., Kieschke, Robert R., Yu, Ta-Hua, Roehrig, Mark A., Nagarkar, Pradnya V., Stay, Matthew S., Dodds, Shawn C., Geaghan, Bernard O.
• Primary Examiner(s): MULVANEY, ELIZABETH EVANS
• Application Number:
  US14/912,125
• Publication Number:
  US 20160200086A1
• Time in Patent Office: 1,154 Days
• CPC Class Codes: B32B 2457/208 Touch screens
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 7/14 applied in spaced arrangements, e.g. in stripes
• CPC Class Codes: G01L 1/146 for measuring force distributions, e.g. using force arrays G01L1/148 takes precedence
• CPC Class Codes: G01L 1/205 using distributed sensing elements
• CPC Class Codes: G01L 1/2287 constructional details of the strain gauges adjustable resistors H01C10/00
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/0447 Position sensing using the local deformation of sensor cells
• CPC Class Codes: G06F 3/047 using sets of wires, e.g. crossed wires
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence

Abstract

Touch sensor layer constructions and methods of making such constructions are described. More particularly, touch sensor constructions that utilize patterned conductive layers that may be applied by a sacrificial release liner, eliminating one or more glass and/or film substrate from touch sensor stacks, and methods of making such constructions are described.

Claims

1. A construction, comprising:

a first patterned conductive layer comprising rows of conductor extending in a first direction, the first patterned conductive layer capable of being transferred from a sacrificial release liner;

an optically clear adhesive positioned on the first patterned conductive layer; and

a protective layer that is positioned on the opposite side of the first patterned conductive layer from the optically clear adhesive,

wherein the protective layer comprises a hardcoat, the hardcoat comprising an alkoxylated multi (meth)acrylate monomer upon which the sacrificial release liner is capable of being attached.

2. The construction of claim 1, further comprising a second patterned conductive layer positioned on the opposite side of the optically clear adhesive from the first patterned conductive layer, the second patterned conductive layer comprising rows of conductor extending in a second direction that is orthogonal to the first direction but in a parallel plane to the first direction.

3. The construction of claim 2, wherein the second patterned conductive layer is at least partially embedded within a second protective layer.

4. The construction of claim 1, further comprising a glass receptor substrate upon which the opposite side of the optically clear adhesive from the first patterned conductive layer is adhered.

5. The construction of claim 1, wherein the first patterned conductive layer comprises patterned indium tin oxide.

6. The construction of claim 1, wherein the first patterned conductive layer comprises silver nanowire.

7. The construction of claim 1, wherein the first patterned conductive layer comprises metal mesh.

8. The construction of claim 1, wherein the first patterned conductive layer comprises carbon nanotubes or graphene.

9. The construction of claim 1, further comprising interconnects that connect to the first patterned conductive layer.

18. The construction of claim 1, further comprising a barrier layer positioned between the protective layer and the first patterned conductive layer.

10. A construction, comprising:

a first patterned conductive layer comprising rows of conductor extending in a first direction, the first patterned conductive layer capable of being transferred from a sacrificial release liner;

an optically clear adhesive positioned on the first patterned conductive layer; and

a second patterned conductive layer positioned on the opposite side of the optically clear adhesive from the first patterned conductive layer, the second patterned conductive layer comprising rows of conductor extending in a second direction that is orthogonal to the first direction but in a parallel plane as the first direction, and the second patterned conductive layer being capable of being transferred to the optically clear adhesive by a sacrificial release liner.

11. A touch sensor comprising:

first and second patterned conductive layers, each capable of being transferred from a sacrificial release layer; and

an optically clear layer disposed between and adhered to the first and second patterned conductive layers, the touch sensor configured to determine a location of a force applied to the touch sensor and at least one of a magnitude and a direction of the applied force.

12. The touch sensor of claim 11, wherein the location of the applied force is determined by a change in a capacitive coupling between the first and second patterned conductive layers.

13. The touch sensor of claim 11, wherein the at least one of the magnitude and the direction of the applied force is determined by a deformation of the optically clear layer.

14. The touch sensor of claim 11, wherein the first and second patterned conductive layers are transferred from the sacrificial release liner.

15. A method, comprising:

providing a release liner,

coating a protective layer onto the release liner,

coating a conductive layer onto the protective layer,

patterning the conductive layer,

removing the release liner,

laminating the protective layer and patterned conductive layer to an optically clear adhesive layer, and

applying a conductive patterned substrate onto the release liner before the protective layer is applied to the release liner, such that the protective layer covers both the conductive patterned substrate and those portions of the release liner that are exposed between a pattern of the conductive patterned substrate.

16. The method of claim 15, wherein the conductive layer is not coated directly onto the protective layer, but includes a further step of coating a first surface of a barrier layer onto the protective layer, and then coating the conductive layer on a second surface of the barrier layer opposite the first surface.

19. The method of claim 15, wherein the conductive layer comprises metal mesh, carbon nanotubes or graphene.

20. The method of claim 15, wherein the conductive layer comprises indium tin oxide or silver.

17. A method, comprising:

providing a first release liner,

coating a protective layer onto the first release liner,

coating a first conductive layer onto the protective layer,

patterning the first conductive layer,

removing the first release liner,

laminating the protective layer and patterned first conductive layer to an optically clear adhesive layer,

providing a second release liner;

coating a second conductive layer onto the second release liner;

patterning the second conductive layer;

laminating the patterned second conductive layer to the opposite side of the optically clear adhesive from the first conductive layer; and

removing the second release liner.