Pressure array sensor module and manufacturing method thereof

• US 9,784,626 B2
• Filed: 12/17/2014
• Issued: 10/10/2017
• Est. Priority Date: 10/03/2014
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Chang-Yi, Su, Jui-Yiao, Liu, Yan-Chen, Liou, Chang-Ho
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): HOPKINS, BRANDI N
• Application Number:
  US14/573,725
• Publication Number:
  US 20160097688A1
• Time in Patent Office: 1,028 Days
• Field of Search: 73862046, 73862627, 73727, 73862045, 73862041, 7386268
• CPC Class Codes: G01L 1/005 by electrical means and not provided for in G01L1/06 - G01L1/22
• CPC Class Codes: G01L 17/005 using a sensor contacting the exterior surface, e.g. for measuring deformation

Abstract

A pressure array sensor module, comprising an array electrode board, a plurality of pressure sensing elements, at least one first conductive structure and at least one second conductive structure is provided. The array electrode board comprises a substrate and an electrode array disposed on the substrate and having a first electrode pattern and a second electrode pattern. Each pressure sensing element is disposed at a sensing position on the array electrode board, and comprises a top electrode layer, a bottom electrode layer and at least one pressure sensing layer disposed between the top electrode layer and the bottom electrode layer. The top electrode layer has a first lead. The bottom electrode layer has a second lead. The first conductive structure electrically connects the first lead and the corresponding first electrode pattern. The second conductive structure electrically connects the second lead and the corresponding second electrode pattern.

Claims

1. A pressure array sensor array module, comprising:

an array electrode board, comprising;

a substrate; and

an electrode array disposed on the substrate and having a first electrode pattern and a second electrode pattern;

a plurality of pressure sensing elements each being disposed at a sensing position on the array electrode board, being a separable independent element, and comprising;

a top electrode layer having a first lead;

a bottom electrode layer having a second lead;

a plurality of connecting portions interspaced by a plurality of gaps and arranged in a circular shape, wherein the first lead of the top electrode layer and the second lead of the bottom electrode layer pass through the gaps between the plurality of the connecting portions; and

at least one pressure sensing layer disposed between the top electrode layer and the bottom electrode layer;

a plurality of first conductive structures each electrically connecting the first lead and the corresponding first electrode pattern; and

a plurality of second conductive structures each electrically connecting the second lead and the corresponding second electrode pattern.

2. The pressure sensor array module according to claim 1, wherein the first electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the first electrode pattern and two corresponding first conductive structures.

3. The pressure sensor array module according to claim 1, wherein the second electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the second electrode pattern and two corresponding second conductive structures.

4. The pressure sensor array module according to claim 1, further comprising:

a plurality of third conductive structures, and

a plurality of fourth conductive structures;

wherein

the electrode array further comprises a third electrode pattern and a fourth electrode pattern disposed on the substrate, wherein each top electrode layer further has a third lead, and each bottom electrode layer further has a fourth lead,

each third conductive structure electrically connects the third lead and the corresponding third electrode pattern, and

each fourth conductive structure electrically connects the fourth lead and the corresponding fourth electrode pattern.

5. The pressure sensor array module according to claim 4, wherein the third electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the third electrode pattern and two corresponding third conductive structures.

6. The pressure sensor array module according to claim 4, wherein the fourth electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the fourth electrode pattern and two corresponding fourth conductive structures.

7. The pressure sensor array module according to claim 4, wherein the top electrode layer of each pressure sensing element is serially connected between the first electrode pattern and the third electrode pattern through the first conductive structures and the third conductive structures.

8. The pressure sensor array module according to claim 4, wherein the bottom electrode layer of each pressure sensing element is serially connected between the second electrode pattern and the fourth electrode pattern through the second conductive structures and the fourth conductive structures.

9. The pressure sensor array module according to claim 1, wherein each pressure sensing element further comprises a top substrate and a bottom substrate, wherein the plurality of connecting portions connects the top substrate and the bottom substrate, and the top electrode layer, the pressure sensing layer and the bottom electrode layer are stacked between the top substrate and the bottom substrate.

10. The pressure sensor array module according to claim 1, wherein the first and the second conductive structures are vertical conductive elements penetrating each pressure sensing element and the array electrode board.

11. The pressure sensor array module according to claim 1, wherein the electrode array is disposed on a side or two opposite sides of the substrate.

12. A manufacturing method of pressure sensor array module, comprising:

forming an electrode array on a side or two opposite sides of a substrate, wherein the electrode array has a first electrode pattern and a second electrode pattern;

disposing a plurality of pressure sensing elements on the substrate, wherein each of the plurality of the pressure sensing elements is a separable independent element and comprises a top electrode layer, a bottom electrode layer, a plurality of connecting portions and at least one pressure sensing layer disposed between the top electrode and the bottom electrode, the top electrode layer has a first lead, the bottom electrode layer has a second lead, the plurality of connecting portions is interspaced by a plurality of gaps and arranged in a circular shape, the first lead of the top electrode layer and the second lead of the bottom electrode layer pass through the gaps between the plurality of the connecting portions;

electrically connecting the first lead and the corresponding first electrode pattern by a plurality of first conductive structures; and

electrically connecting the second lead and the corresponding second electrode pattern by a plurality of second conductive structures.

13. The manufacturing method according to claim 12, wherein the first electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the first electrode pattern and two corresponding first conductive structures.

14. The manufacturing method according to claim 12, wherein the second electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the second electrode pattern and two corresponding second conductive structures.

15. The manufacturing method according to claim 12, wherein the electrode array further comprises a third electrode pattern and a fourth electrode pattern disposed on the substrate, each top electrode layer further has a third lead, each bottom electrode layer further has a fourth lead, and the manufacturing method of pressure sensor array module further comprises:

electrically connecting each third lead and the corresponding third electrode pattern by a plurality of third conductive structures; and

electrically connecting each fourth lead and the corresponding fourth electrode pattern by a plurality of fourth conductive structures.

16. The manufacturing method according to claim 15, wherein the third electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the third electrode pattern and two corresponding third conductive structures.

17. The manufacturing method according to claim 15, wherein the fourth electrode pattern is extended between two of the plurality of adjacent pressure sensing elements, and the two of the plurality of the adjacent pressure sensing elements are electrically connected through the fourth electrode pattern and two corresponding fourth conductive structures.

18. The manufacturing method according to claim 15, wherein the top electrode layer of each pressure sensing element is serially connected between the first electrode pattern and the third electrode pattern through the first conductive structures and the third conductive structures.

19. The manufacturing method according to claim 15, wherein the bottom electrode layer of each pressure sensing element is serially connected between the second electrode pattern and the fourth electrode pattern through the second conductive structures and the fourth conductive structures.

20. The manufacturing method according to claim 12, wherein the first and the second conductive structures are vertical conductive elements.