Method for forming multi-layer film and patterning process

• US 9,785,049 B2
• Filed: 12/14/2016
• Issued: 10/10/2017
• Est. Priority Date: 01/12/2016
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Hatakeyama, Jun, Kori, Daisuke
• Primary Examiner(s): KUSUMAKAR, KAREN M
• Application Number:
  US15/379,123
• Publication Number:
  US 20170199457A1
• Time in Patent Office: 300 Days
• CPC Class Codes: G03F 7/0397 the macromolecular compound having an alicyclic moiety in a side chain
• CPC Class Codes: G03F 7/0752 in non photosensitive layers or as additives, e.g. for dry lithography
• CPC Class Codes: G03F 7/091 characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
• CPC Class Codes: G03F 7/094 Multilayer resist systems, e.g. planarising layers
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31122 of layers not containing Si, e.g. PZT, Al2O3
• CPC Class Codes: H01L 21/31138 by dry-etching
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/32139 using masks

Abstract

The present invention provides a method for forming a multi-layer film, including (i) forming an under layer film on a substrate by applying an under layer film material containing one or more species selected from resins having a repeating unit shown by the formula (1), resins having a repeating unit shown by the formula (2), and compounds shown by the formula (3), each containing a fluorene structure, and curing the same by heat treatment at 300° C. to 800° C. for 10 to 4,000 seconds; (ii) forming a titanium nitride film or a titanium oxynitride film on the under layer film; (iii) forming a hydrocarbon film on the titanium nitride film or the titanium oxynitride film; and (iv) forming a silicon oxide film on the hydrocarbon film. This can form a multi-layer film with reduced reflectance useful for a patterning process with high dimensional accuracy in dry etching.

Claims

1. A method for forming a multi-layer film on a substrate, comprising the steps of:

(i) forming an under layer film on the substrate by applying an under layer film material containing one or more species selected from the group consisting of resins having a repeating unit shown by the following general formula (1) in which a fluorene structure is contained, resins having a repeating unit shown by the following general formula (2) in which a fluorene structure is contained, and compounds shown by the following general formula (3) in which a fluorene structure is contained, and curing the same by heat treatment at a temperature of 300°

C. or higher and 800°

C. or lower for 10 to 4,000 seconds;

(ii) forming a titanium nitride film or a titanium oxynitride film on the under layer film;

(iii) forming a hydrocarbon film on the titanium nitride film or the titanium oxynitride film by applying a hydrocarbon film material; and

(iv) forming a silicon oxide film on the hydrocarbon film by applying a silicon oxide film material,

2. The method for forming a multi-layer film according to claim 1, wherein applying of the materials in the steps (i), (iii), and (iv) is carried out by a spin coating method.

3. The method for forming a multi-layer film according to claim 1, wherein forming of the titanium nitride film or the titanium oxynitride film in the step (ii) is carried out by a sputtering method or a CVD method.

4. The method for forming a multi-layer film according to claim 2, wherein forming of the titanium nitride film or the titanium oxynitride film in the step (ii) is carried out by a sputtering method or a CVD method.

5. The method for forming a multi-layer film according to claim 1, wherein the under layer film having a film thickness of 30 to 20,000 nm is formed in the step (i), the titanium nitride film or the titanium oxynitride film having a film thickness of 3 to 100 nm is formed in the step (ii), the hydrocarbon film having a film thickness of 5 to 100 nm is formed in the step (iii), and the silicon oxide film having a film thickness of 10 to 20 nm is formed in the step (iv).

6. The method for forming a multi-layer film according to claim 2, wherein the under layer film having a film thickness of 30 to 20,000 nm is formed in the step (i), the titanium nitride film or the titanium oxynitride film having a film thickness of 3 to 100 nm is formed in the step (ii), the hydrocarbon film having a film thickness of 5 to 100 nm is formed in the step (iii), and the silicon oxide film having a film thickness of 10 to 20 nm is formed in the step (iv).

7. The method for forming a multi-layer film according to claim 3, wherein the under layer film having a film thickness of 30 to 20,000 nm is formed in the step (i), the titanium nitride film or the titanium oxynitride film having a film thickness of 3 to 100 nm is formed in the step (ii), the hydrocarbon film having a film thickness of 5 to 100 nm is formed in the step (iii), and the silicon oxide film having a film thickness of 10 to 20 nm is formed in the step (iv).

8. The method for forming a multi-layer film according to claim 4, wherein the under layer film having a film thickness of 30 to 20,000 nm is formed in the step (i), the titanium nitride film or the titanium oxynitride film having a film thickness of 3 to 100 nm is formed in the step (ii), the hydrocarbon film having a film thickness of 5 to 100 nm is formed in the step (iii), and the silicon oxide film having a film thickness of 10 to 20 nm is formed in the step (iv).

9. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 1;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

10. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 2;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

11. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 3;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

12. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 4;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

13. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 5;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

14. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 6;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

15. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 7;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

16. A patterning process comprising the steps of:

(A) forming a photoresist film on the multi-layer film which has been formed on the substrate by the method for forming a multi-layer film according to claim 8;

(B) forming a photoresist pattern by subjecting the photoresist film to exposure and development;

(C) transferring the pattern to the silicon oxide film by dry etching using the photoresist pattern as a mask;

(D) transferring the pattern to the hydrocarbon film by dry etching using the silicon oxide film to which the pattern has been transferred as a mask;

(E) transferring the pattern to the titanium nitride film or the titanium oxynitride film by dry etching using the hydrocarbon film to which the pattern has been transferred as a mask;

(F) transferring the pattern to the under layer film by dry etching using the titanium nitride film or the titanium oxynitride film to which the pattern has been transferred as a mask; and

(G) transferring the pattern to the substrate by dry etching using the titanium nitride film or the titanium oxynitride film and the under layer film to which the pattern has been transferred as a mask.

17. The patterning process according to claim 9, wherein the dry etching in the step (F) is carried out by using one or more etching gases selected from an oxygen gas, a hydrogen gas, an ammonia gas, a carbon dioxide gas, a carbon monoxide gas, and a sulfur dioxide gas.

18. The patterning process according to claim 10, wherein the dry etching in the step (F) is carried out by using one or more etching gases selected from an oxygen gas, a hydrogen gas, an ammonia gas, a carbon dioxide gas, a carbon monoxide gas, and a sulfur dioxide gas.

19. The patterning process according to claim 11, wherein the dry etching in the step (F) is carried out by using one or more etching gases selected from an oxygen gas, a hydrogen gas, an ammonia gas, a carbon dioxide gas, a carbon monoxide gas, and a sulfur dioxide gas.

20. The patterning process according to claim 13, wherein the dry etching in the step (F) is carried out by using one or more etching gases selected from an oxygen gas, a hydrogen gas, an ammonia gas, a carbon dioxide gas, a carbon monoxide gas, and a sulfur dioxide gas.