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Component arrangement

  • US 9,786,426 B2
  • Filed: 06/25/2014
  • Issued: 10/10/2017
  • Est. Priority Date: 06/26/2013
  • Status: Active Grant
First Claim
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1. A component arrangement comprising:

  • a carrier, wherein at least one electronic component is formed in the carrier;

    a first metallization layer above the carrier, wherein the first metallization layer comprises a first metallic coupling structure, which is coupled to the at least one electronic component;

    a second metallization layer above the first metallization layer, wherein the second metallization layer comprises a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by at least one via;

    a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and which are electrically conductively coupled to one another in such a way that they form a coil comprising a coil region situated at an angle with respect to the main processing surface of the carrier;

    a third metallization layer above the second metallization layer, wherein the third metallization layer comprises a third metallic coupling structure, wherein the second metallic coupling structure is coupled to the third metallic coupling structure by at least one via; and

    wherein some of the additional vias extend at least between the first metallization layer and the third metallization layer;

    wherein the coil comprises a plurality of coil turns;

    wherein the at least two coil turns define the coil region;

    wherein the plurality of additional vias extend at least between the first metallization layer and the second metallization layer in such a way that the coil region is situated substantially perpendicularly to the main processing surface of the carrier; and

    wherein the coil comprises a coil turn, and wherein the coil turn is substantially perpendicular to the main processing surface of the carrier.

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