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Power device having reduced thickness

  • US 9,786,516 B2
  • Filed: 11/20/2015
  • Issued: 10/10/2017
  • Est. Priority Date: 06/30/2011
  • Status: Active Grant
First Claim
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1. A method for making an electronic device that includes an electronic component integrated within a chip, the chip comprising a first conduction terminal on a first surface of the chip, and a second conduction terminal and a third conduction terminal on a second surface of the chip opposite said first surface, comprising:

  • forming a first recess in a first heat sink, said first recess peripherally surrounded by a side wall defining a first recess depth and having a first mounting surface at a bottom of the first recess having a mounting area;

    attaching the first surface of the chip to the first mounting surface of the first heat sink;

    forming a second recess in a second heat sink;

    contacting the second heat sink to the second conduction terminal, the second recess of the second heat sink extending over at least one portion of the third conduction terminal for insulating the third conduction terminal from the second heat sink; and

    encapsulating the chip, the first heat sink and the second heat sink within an insulating body providing a mounting surface supporting mounting to a board.

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