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Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages

  • US 9,786,567 B2
  • Filed: 01/25/2017
  • Issued: 10/10/2017
  • Est. Priority Date: 03/13/2013
  • Status: Active Grant
First Claim
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1. A method for testing a package structure comprising:

  • electrically testing a first plurality of conductive connectors in a first package, wherein the first plurality of conductive connectors bonds a first package component to a second package component, and wherein the first package component comprises;

    first testing structures on a first substrate; and

    first functional circuitry on the first substrate and independent from the first testing structures; and

    electrically testing a second plurality of conductive connectors in a second package, wherein the second plurality of conductive connectors bonds a third package component to a fourth package component, and wherein the third package component comprises;

    second testing structures on a second substrate and having a same circuit layout as the first testing structures, wherein a first electrical signal sent through the first testing structures during electrically testing the first plurality of conductive connectors is a same signal as a second electrical signal sent through the second testing structures during electrically testing the second plurality of conductive connectors; and

    second functional circuitry on the second substrate and independent from the second testing structures, wherein the second functional circuitry has a different circuit layout as the first functional circuitry.

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