Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
First Claim
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1. A method for testing a package structure comprising:
- electrically testing a first plurality of conductive connectors in a first package, wherein the first plurality of conductive connectors bonds a first package component to a second package component, and wherein the first package component comprises;
first testing structures on a first substrate; and
first functional circuitry on the first substrate and independent from the first testing structures; and
electrically testing a second plurality of conductive connectors in a second package, wherein the second plurality of conductive connectors bonds a third package component to a fourth package component, and wherein the third package component comprises;
second testing structures on a second substrate and having a same circuit layout as the first testing structures, wherein a first electrical signal sent through the first testing structures during electrically testing the first plurality of conductive connectors is a same signal as a second electrical signal sent through the second testing structures during electrically testing the second plurality of conductive connectors; and
second functional circuitry on the second substrate and independent from the second testing structures, wherein the second functional circuitry has a different circuit layout as the first functional circuitry.
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Abstract
An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.
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Citations
20 Claims
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1. A method for testing a package structure comprising:
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electrically testing a first plurality of conductive connectors in a first package, wherein the first plurality of conductive connectors bonds a first package component to a second package component, and wherein the first package component comprises; first testing structures on a first substrate; and first functional circuitry on the first substrate and independent from the first testing structures; and electrically testing a second plurality of conductive connectors in a second package, wherein the second plurality of conductive connectors bonds a third package component to a fourth package component, and wherein the third package component comprises; second testing structures on a second substrate and having a same circuit layout as the first testing structures, wherein a first electrical signal sent through the first testing structures during electrically testing the first plurality of conductive connectors is a same signal as a second electrical signal sent through the second testing structures during electrically testing the second plurality of conductive connectors; and second functional circuitry on the second substrate and independent from the second testing structures, wherein the second functional circuitry has a different circuit layout as the first functional circuitry. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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bonding a first package component to a second package component using a first plurality of conductive bumps, wherein the first package component comprises; first testing structures comprising first test bumps and a first plurality of electrically interconnected conductive lines electrically connected to the first test bumps; and first functional circuitry on a same substrate as the first testing structures and independent from the first testing structures; bonding a third package component to a fourth package component using a second plurality of conductive bumps, wherein the third package component comprises; second testing structures comprising second test bumps and a second plurality of electrically interconnected conductive lines electrically connected to the second test bumps, wherein the first plurality of electrically interconnected conductive lines and the second plurality of electrically interconnected conductive lines have a same layout; and second functional circuitry on a same substrate as the second testing structures and independent from the second testing structures, wherein the second functional circuitry and the first functional circuitry have different layouts; electrically testing the first plurality of conductive bumps using the first testing structures; and electrically testing the second plurality of conductive bumps using the second testing structures. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method comprising
providing a testing structure design, the testing structure design defining: -
test bumps; and a plurality of conductive lines electrically connected to the test bumps; disposing a first package component in a first package, wherein the first package component comprises; first testing structures in accordance with the testing structure design; and first functional circuitry formed on a same substrate as the first testing structures and independent from the first testing structures; and disposing a second package component in a second package, wherein the second package component comprises; second testing structures in accordance with the testing structure design; and second functional circuitry formed on a same substrate as the second testing structures and independent from the second testing structures, wherein the second functional circuitry and the first functional circuitry have different layouts. - View Dependent Claims (17, 18, 19, 20)
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Specification