Ceramic-based light emitting diode (LED) devices, components, and methods

• US 9,786,825 B2
• Filed: 03/15/2013
• Issued: 10/10/2017
• Est. Priority Date: 02/07/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P.
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): INOUSSA, MOULOUCOULAY
• Application Number:
  US13/836,940
• Publication Number:
  US 20130200406A1
• Time in Patent Office: 1,670 Days
• Field of Search: 257 98, 257 99, 257100, 257431, 257E21592, 257E33072, 257E21009, 257E21054, 257E23009, 257243, 313498, 313506, 438 7, 438 27, 438698
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.

Claims

1. A light emitter device component comprising:

a non-metallic body having a top surface and a bottom surface opposing the top surface;

at least one or more base layer coupled to the bottom surface and extending beyond at least a portion of a footprint of the non-metallic body, the one or more base layer comprising a substrate bonded to one of a reflective film or a reflective foil positioned against the bottom surface of the non-metallic body, the substrate comprising aluminum;

one or more light emitter devices mounted on the top surface, the non-metallic body having a width that is greater than a width of the one or more light emitter devices; and

one or more electrical components mounted on the top surface separate from the one or more light emitter devices but electrically coupled to the one or more light emitter devices;

wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and

wherein the reflective film or reflective foil is positioned to reflect the light transmitted to the bottom surface.

2. The light emitter device component according to claim 1, wherein the non-metallic body comprises a ceramic material.

3. The light emitter device component according to claim 2, wherein the non-metallic body comprises a thick-film ceramic substrate.

4. The light emitter device component according to claim 2, wherein the non-metallic body comprises a thin-film ceramic substrate.

5. The light emitter device component according to claim 2, wherein the non-metallic body has an open porosity of between approximately 0% and 15%.

6. The light emitter device component according to claim 1, wherein the non-metallic body has a thickness of 2 mm or less, 1.5 mm or less, or 1 mm or less.

7. The light emitter device component according to claim 1, wherein the one or more base layer is coupled to the non-metallic body by a layer of adhesive material.

8. The light emitter device component according to claim 7, wherein the layer of adhesive material comprises a layer of an epoxy, a silicone adhesive, a silicone RTV and/or a pressure sensitive adhesive.

9. The light emitter device component according to claim 1, wherein the reflective film or reflective foil comprises a reflective film having a thickness of between approximately 0.1 and 5 μ

m.

10. The light emitter device component according to claim 1, wherein the reflective film or reflective foil comprises a reflective foil having a thickness of between approximately 25 and 200 μ

m.

11. The light emitter device component according to claim 1, wherein the one or more base layer comprises a reflective material having a thickness of between approximately 0.25 and 1.5 mm.

12. The light emitter device component according to claim 1, wherein the one or more electrical components are spaced from the non-metallic body by one or more non-metallic layers.

37. The light emitter device of claim 1, wherein the one or more light emitter devices are mounted on the top surface by one or more non-metallic layers.

13. A method of forming a light emitter device component, the method comprising:

coupling a bottom surface of a non-metallic body to one or more base layer comprising a substrate bonded to one of a reflective film or a reflective foil positioned against the bottom surface of the non-metallic body, the substrate comprising aluminum, and the one or more base layer extending beyond at least a portion of a footprint of the non-metallic body;

mounting one or more light emitter devices on a top surface of the non-metallic body opposing the bottom surface without metal layers at a die attach interface, the non-metallic body having a width that is greater than a width of the one or more light emitter devices;

providing one or more non-metallic layer on the top surface of the non-metallic body; and

mounting one or more electrical components to the one or more non-metallic layer and electrically coupling the one or more electrical components to the one or more light emitter devices;

wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and

wherein the reflective film or reflective foil is positioned to reflect the light transmitted to the bottom surface.

14. The method of claim 13, wherein coupling a bottom surface of a non-metallic body to one or more base layer comprises applying a layer of adhesive material between the non-metallic body and the one or more base layer.

15. The method of claim 14, wherein applying a layer of adhesive material comprises applying a layer of an epoxy, a silicone adhesive, a silicone RTV, and/or a pressure sensitive adhesive.

16. The method of claim 13, wherein the reflective film or reflective foil comprises a reflective film having a thickness of between approximately 0.1 and 5 μ

m.

17. The method of claim 13, wherein the reflective film or reflective foil comprises a reflective foil having a thickness of between approximately 25 and 200 μ

m.

18. The method of claim 13, wherein the one or more base layer comprises a reflective material having a thickness of between approximately 0.25 and 1.5 mm.

19. The method of claim 13, wherein the non-metallic body comprises a ceramic body.

20. The method of claim 19, wherein the ceramic body comprises thick-film ceramic substrate.

21. The method of claim 19, wherein the ceramic body comprises thin-film ceramic substrate.

22. The method of claim 19, wherein the ceramic body has an open porosity of between approximately 0% and 15%.

23. The method of claim 13, wherein the non-metallic body has a thickness of 2 mm or less, 1.5 mm or less, or 1 mm or less.

24. The method of claim 13, wherein the one or more electrical components are spaced from the non-metallic body by the one or more non-metallic layer.

25. A light emitter device component comprising:

a non-metallic body having a top surface and a bottom surface opposing the top surface;

at least one base layer coupled against the bottom surface of the body, the base layer comprising a substrate bonded to one of a reflective film or a reflective foil, the substrate comprising aluminum;

the base layer being adapted for attachment to another structure;

one or more light emitter devices mounted over the top surface of the body, the non-metallic body having a width that is greater than a width of the one or more light emitter devices; and

one or more electrical components mounted on the top surface separate from the one or more light emitter devices but electrically coupled to the one or more light emitter devices;

wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and

wherein the at least one base layer is positioned to reflect the light transmitted to the bottom surface.

26. The light emitter device component according to claim 25, wherein the non-metallic body comprises ceramic.

27. The light emitter device component according to claim 26, wherein the non-metallic body has an open porosity of between approximately 0% and 15%.

28. The light emitter device component according to claim 25, wherein the base layer is coupled to the non-metallic body by a layer of adhesive material.

29. The light emitter device component according to claim 25, wherein the one or more electrical components are spaced from the non-metallic body by one or more non-metallic layers.

30. The light emitter device component according to claim 25, wherein the base layer is adapted for attachment to another structure by one or more openings defined in the base layer with the openings being adapted for receiving one or more fasteners.

38. The light emitter device component of claim 25, wherein the one or more light emitter devices are mounted over the top surface of the body by one or more non-metallic layers.

31. A method of forming a light emitter device component, the method comprising:

coupling a bottom surface of a non-metallic body against at least one base layer, the base layer comprising a substrate bonded to one of a reflective film or a reflective foil and being adapted for attachment to another structure, the substrate comprising aluminum;

mounting one or more light emitter devices on a top surface of the non-metallic body, the non-metallic body having a width that is greater than a width of the one or more light emitter devices; and

mounting one or more electrical components to the top surface of the non-metallic body separate from the one or more light emitter devices and electrically coupling the one or more electrical components to the one or more light emitter devices;

wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and

wherein the at least one base layer is positioned to reflect the light transmitted to the bottom surface.

32. The method of claim 31, wherein coupling a bottom surface of a non-metallic body to one or more base layer comprises applying a layer of adhesive material between the non-metallic body and the base layer.

33. The method of claim 31 wherein the non-metallic body comprises ceramic.

34. The method of claim 33, wherein the ceramic body has an open porosity of between approximately 0% and 15%.

35. The method of claim 31, comprising positioning a fastener through at least one of one or more openings defined in the base layer.

39. The method of claim 31, wherein mounting one or more light emitter devices on a top surface of the non-metallic body comprises mounting the one or more light emitter devices on the top surface without metal layers at a die attach interface.

36. A light emitter device component comprising:

a non-metallic body having a top surface and a bottom surface opposing the top surface;

at least one or more base layer coupled to the bottom surface and extending beyond a footprint of the non-metallic body, the one or more base layer comprising at least one reflective material layer positioned against the bottom surface of the non-metallic body;

an array of light emitter devices mounted on the top surface, the non-metallic body having a width that is greater than a width of each light emitter device of the array of light emitter devices; and

one or more electrical components mounted on the top surface and electrically coupled to the array of light emitter devices;

wherein the non-metallic body has a porosity configured to provide between about 50 percent and about 90 percent total reflection such that the non-metallic body is configured to reflect a portion of light emitted by the array of light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and

wherein the at least one reflective material layer is positioned to reflect the light transmitted to the bottom surface.