Printed circuit board and power supply device

• US 9,788,410 B2
• Filed: 08/12/2014
• Issued: 10/10/2017
• Est. Priority Date: 08/13/2013
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Uchiyama, Tomohiko, Murai, Yasuhiro
• Primary Examiner(s): Lian, Mangtin
• Application Number:
  US14/457,709
• Publication Number:
  US 20150048917A1
• Time in Patent Office: 1,155 Days
• Field of Search: 336200, 336 61, 336212, 336232
• CPC Class Codes: H01F 2027/2819 Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A′ and 95B′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.

Claims

1. A printed circuit board assembly, comprising:

a printed circuit board including;

a substrate comprised of an insulation material;

a hole; and

a conductive pattern formed on a surface of the substrate, the conductive pattern including;

a first side in contact with the substrate; and

a second side opposite the first side, the second side having a surface-shaped coil pattern formed around the hole, the coil pattern including;

a connection area thermally connected to a heat radiating member; and

a covered area outside of the connection area where a cover layer is formed, a thickness of a conductor forming the coil pattern being smaller than two times a thickness of the cover layer; and

a magnetic core disposed on the printed circuit board, the magnetic core including;

a leg disposed inside the hole; and

a flat plate that overlaps the covered area when viewed perpendicularly to the printed circuit board.

2. The printed circuit board assembly according to claim 1, further comprising:

a dummy portion on a different portion of the surface of the substrate than the surface-shaped exposure area, including;

a second conductive pattern; and

a second cover layer formed on a surface of the second conductive pattern.

3. A power supply device comprising:

the printed circuit board assembly set forth in of claim 1; and

a housing for accommodating the printed circuit board assembly,

wherein the coil pattern is installed on a lower surface of the printed circuit board, the coil pattern is thermally connected to the housing, and a bottom surface of the housing functions as the heat radiating member.