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Methods for mold release of body-mountable devices including microelectronics

  • US 9,789,655 B1
  • Filed: 03/14/2014
  • Issued: 10/17/2017
  • Est. Priority Date: 03/14/2014
  • Status: Active Grant
First Claim
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1. A method for fabricating a body-mountable device, the method comprising:

  • forming a first polymer layer between a first molding piece and a second molding piece, wherein the first molding piece and the second molding piece combine to form a mold cavity, wherein the first molding piece has a first surface layer, the second molding piece has a second surface layer, and at least one of the first or second surface layers facilitates release of the first polymer layer from at least one of the first or second molding piece, and wherein the first polymer layer defines a first side of the body-mountable device;

    releasing the first polymer layer from at least one of the first or second molding piece;

    after releasing the first polymer layer from at least one of the first or second molding piece, positioning a structure on the first polymer layer, wherein the structure comprises at least one sensor configured to detect an analyte; and

    forming a second polymer layer between the first polymer layer and a third molding piece, such that the structure is at least partially enclosed by the first polymer layer and the second polymer layer, wherein the third molding piece has a third surface layer that facilitates release of the second polymer layer from the third molding piece, and wherein the second polymer layer defines a second side of the body-mountable device.

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