Imaging module and electronic device

• US 9,791,659 B2
• Filed: 01/27/2016
• Issued: 10/17/2017
• Est. Priority Date: 07/30/2013
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Yamakawa, Kenji, Takase, Yoshiyuki, Inamura, Masaru, Fujinami, Tatsuya, Tobise, Manabu
• Primary Examiner(s): Tran, Nhan T
• Application Number:
  US15/008,122
• Publication Number:
  US 20160139357A1
• Time in Patent Office: 629 Days
• Field of Search: 348374, 348373, 348335
• CPC Class Codes: G02B 27/646 compensating for small deviations, e.g. due to vibration or shake movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68
• CPC Class Codes: G02B 7/023 permitting adjustment
• CPC Class Codes: G02B 7/04 with mechanism for focusing or varying magnification
• CPC Class Codes: G02B 7/08 adapted to co-operate with a remote control mechanism
• CPC Class Codes: G03B 17/02 Bodies
• CPC Class Codes: G03B 2205/0069 using electromagnetic actuators, e.g. voice coils
• CPC Class Codes: G03B 3/10 Power-operated focusing
• CPC Class Codes: G03B 5/00 Adjustment of optical system relative to image or object surface other than for focusing
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The present invention provides an imaging module capable of performing positioning of an imaging element unit, and a lens unit at a low cost and with high precision and an electronic device including the imaging module. An imaging module 100 includes a lens unit 10 including VCMs 16A, 16C, and 16E which move a lens group 12 in an x direction, a y direction, and a z direction, respectively, terminals 14A and 14B which are connected to the VCM 16A, terminals 14C and 14D which are connected to the VCM 16C, and terminals 14E and 14F which are connected to the VCM 16E, and an imaging element unit 20 including terminals 24A to 24F which are connected to the terminals 14A to 14F. Exposed areas of the terminals 14A and 14B are larger than exposed areas of the terminals 14C to 14F.

Claims

1. A manufacturing method of an imaging module including

a lens unit which includes a lens group, and

an imaging element unit which is fixed to the lens unit and includes an imaging element which captures a subject through the lens group,

wherein the lens unit includes

a first lens driving unit which moves at least a portion of lenses of the lens group in a first direction along an optical axis of the lens group,

a second lens driving unit and a third lens driving unit which move at least a portion of the lenses of the lens group in a second direction and a third direction orthogonal to the optical axis of the lens group, respectively,

a connection portion group which includes a plurality of first connection portions which electrically connect the first lens driving unit and the imaging element unit, a plurality of second connection portions which electrically connect the second lens driving unit and the imaging element unit, and a plurality of third connection portions which electrically connect the third lens driving unit and the imaging element unit, and

a housing in which at least the first lens driving unit, the second lens driving unit, the third lens driving unit, and a portion of the connection portion group is accommodated,

wherein the imaging element unit includes a fourth connection portion which electrically connects the imaging element unit and each connection portion included in the connection portion group of the lens unit,

wherein each connection portion included in the connection portion group includes an exposed surface, which is exposed outside the housing, in a portion of the connection portion,

wherein the connection portion group includes a connection portion in which the exposed surface has a first area, and a connection portion in which the exposed surface has a second area which is larger than the first area, and

wherein among the plurality of first connection portions, the plurality of second connection portions, and the plurality of third connection portions, any one of the exposed surfaces of at least the plurality of second connection portions and the plurality of third connection portions has the second area,

the manufacturing method comprising:

an adjustment process of allowing electricity to flow to the connection portion having the second area in a probing manner so as to drive the lens driving unit, and adjusting positions of the lens unit and the imaging element unit; and

a process of fixing the lens unit and the imaging element unit after the adjustment process.

2. The manufacturing method of the imaging module according to claim 1,

wherein the exposed surface of each connection portion of the plurality of first connection portions has the first area, and

wherein at least one exposed surface of the plurality of second connection portions and the plurality of third connection portions has the second area.

3. The manufacturing method of the imaging module according to claim 2,

wherein the second direction and the third direction are orthogonal to each other, and

wherein the exposed surface of at least one connection portion of the plurality of second connection portions has the second area, and the exposed surface of each connection portion of the plurality of third connection portions has the first area.

4. The manufacturing method of the imaging module according to claim 1,

wherein each of the exposed surface of each connection portion of the plurality of first connection portions, the exposed surface of each connection portion of the plurality of second connection portions, and the exposed surface of each connection portion of the plurality of third connection portions has the second area.

5. The manufacturing method of the imaging module according to claim 1,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length of the connection portion in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area, and

wherein the connection portion in which the exposed surface has the second area and the connection portion in which the exposed surface has the first area are arranged in directions along sides different from each other of the imaging element in the plan view.

6. The manufacturing method of the imaging module according to claim 2,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length of the connection portion in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area, and

wherein the connection portion in which the exposed surface has the second area and the connection portion in which the exposed surface has the first area are arranged in directions along sides different from each other of the imaging element in the plan view.

7. The manufacturing method of the imaging module according to claim 3,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length of the connection portion in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area, and

wherein the connection portion in which the exposed surface has the second area and the connection portion in which the exposed surface has the first area are arranged in directions along sides different from each other of the imaging element in the plan view.

8. The manufacturing method of the imaging module according to claim 4,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length of the connection portion in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area, and

wherein the connection portion in which the exposed surface has the second area and the connection portion in which the exposed surface has the first area are arranged in directions along sides different from each other of the imaging element in the plan view.

9. The manufacturing method of the imaging module according to claim 1,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area,

wherein the connection portion group includes a plurality of connection portions in which the exposed surfaces have the second areas, and

wherein a portion of the plurality of connection portions in which the exposed surfaces have the second areas, and remaining connection portions except for the portion of the plurality of connection portions are arranged in directions along sides different from each other of the imaging element in the plan view.

10. The manufacturing method of the imaging module according to claim 2,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area,

wherein the connection portion group includes a plurality of connection portions in which the exposed surfaces have the second areas, and

wherein a portion of the plurality of connection portions in which the exposed surfaces have the second areas, and remaining connection portions except for the portion of the plurality of connection portions are arranged in directions along sides different from each other of the imaging element in the plan view.

11. The manufacturing method of the imaging module according to claim 3,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area,

wherein the connection portion group includes a plurality of connection portions in which the exposed surfaces have the second areas, and

wherein a portion of the plurality of connection portions in which the exposed surfaces have the second areas, and remaining connection portions except for the portion of the plurality of connection portions are arranged in directions along sides different from each other of the imaging element in the plan view.

12. The manufacturing method of the imaging module according to claim 4,

wherein the connection portions included in the connection portion group are arranged in a direction along a side of the imaging element in a plan view when viewed from the subject side,

wherein a length of the connection portion in an arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length in the arrangement direction on the exposed surface of the connection portion in which the exposed surface has the first area,

wherein the connection portion group includes a plurality of connection portions in which the exposed surfaces have the second areas, and

wherein a portion of the plurality of connection portions in which the exposed surfaces have the second areas, and remaining connection portions except for the portion of the plurality of connection portions are arranged in directions along sides different from each other of the imaging element in the plan view.

13. The manufacturing method of the imaging module according to claim 9,

wherein a connection portion, in which the exposed surface has the first area, is disposed in at least one location between the plurality of connection portions which are arranged in the arrangement direction and in which the exposed surfaces have the second areas.

14. The manufacturing method of the imaging module according to claim 1,

wherein the connection portion group includes a plurality of connection portions in which the exposed surfaces have the second areas, and

wherein a connection portion, in which the exposed surface has the first area, is disposed in at least one location between the plurality of connection portions in which the exposed surfaces have the second areas.

15. The manufacturing method of the imaging module according to claim 2,

wherein the connection portion group includes a plurality of connection portions in which the exposed surfaces have the second areas, and

wherein a connection portion, in which the exposed surface has the first area, is disposed in at least one location between the plurality of connection portions in which the exposed surfaces have the second areas.

16. The manufacturing method of the imaging module according to claim 1,

wherein the connection portions included in the connection portion group are arranged in a direction along the side of the imaging element in a plan view when viewed from the subject side, and

wherein a length of the connection portion in a direction orthogonal to the arrangement direction of the connection portions included in the connection portion group on the exposed surface of the connection portion in which the exposed surface has the second area is longer than a length of the connection portion in the orthogonal direction on the exposed surface of the connection portion in which the exposed surface has the first area.

17. The manufacturing method of the imaging module according to claim 1,

wherein a pixel pitch of the imaging element is 1.0 μ

m or less.

18. The manufacturing method of an image module according to claim 1,

wherein in the adjustment process, the positions of the lens unit and the imaging element unit are adjusted in a state where the second direction and the third direction are set to the gravity direction.

19. An imaging module comprising:

a lens unit which includes a lens group; and

an imaging element unit which is fixed to the lens unit and includes an imaging element which captures a subject through the lens group,

wherein the lens unit includes

a first lens driving unit which moves at least a portion of lenses of the lens group in a first direction along an optical axis of the lens group,

a second lens driving unit and a third lens driving unit which move at least a portion of the lenses of the lens group in a second direction and a third direction orthogonal to the optical axis of the lens group, respectively,

a connection portion group which includes a plurality of first connection portions which electrically connect the first lens driving unit and the imaging element unit, a plurality of second connection portions which electrically connect the second lens driving unit and the imaging element unit, and a plurality of third connection portions which electrically connect the third lens driving unit and the imaging element unit, and

a housing in which at least a portion of the first lens driving unit, the second lens driving unit, the third lens driving unit, and the connection portion group is accommodated,

wherein the imaging element unit includes a fourth connection portion which electrically connects the imaging element unit and each connection portion included in the connection portion group of the lens unit,

wherein each connection portion included in the connection portion group includes an exposed surface, which is exposed outside the housing, in a portion of the connection portion,

wherein the connection portion group includes a connection portion in which the exposed surface has a first area, and a connection portion in which the exposed surface has a second area which is larger than the first area and which is an area to allow electricity to flow in a probing manner when the imaging module is manufactured, and

wherein among the plurality of first connection portions, the plurality of second connection portions, and the plurality of third connection portions, any one of the exposed surfaces of at least the plurality of second connection portions and the plurality of third connection portions has the second area.

20. An electronic device, comprising the imaging module according to claim 19.