Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
First Claim
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1. A method for forming a capacitor comprising:
- providing an aluminum containing anode with an aluminum oxide dielectric thereon;
forming a cathode on a first portion of said aluminum oxide dielectric;
bonding an anode lead to said aluminum anode on a second portion of said aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding said aluminum anode to said anode lead; and
bonding a cathode lead to said cathode.
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Abstract
An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
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Citations
20 Claims
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1. A method for forming a capacitor comprising:
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providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of said aluminum oxide dielectric; bonding an anode lead to said aluminum anode on a second portion of said aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding said aluminum anode to said anode lead; and bonding a cathode lead to said cathode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification