Conductive connections, structures with such connections, and methods of manufacture

• US 9,793,198 B2
• Filed: 05/12/2014
• Issued: 10/17/2017
• Est. Priority Date: 05/12/2014
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Uzoh, Cyprian Emeka, Katkar, Rajesh
• Primary Examiner(s): Kraig, William F
• Assistant Examiner(s): RAHMAN, KHATIB A
• Application Number:
  US14/275,519
• Publication Number:
  US 20150325507A1
• Time in Patent Office: 1,254 Days
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/0266 flux-cored
• CPC Class Codes: B23K 35/22 characterised by the composition or nature of the material
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/03 Manufacturing methods
• CPC Class Codes: H01L 2224/03001 Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/03009 for protecting parts during manufacture
• CPC Class Codes: H01L 2224/03318 by dispensing droplets
• CPC Class Codes: H01L 2224/0332 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/0333 in solid form
• CPC Class Codes: H01L 2224/03334 using a preform
• CPC Class Codes: H01L 2224/0348 Permanent masks, i.e. masks left in the finished device, e.g. passivation layers
• CPC Class Codes: H01L 2224/03848 Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/03849 Reflowing
• CPC Class Codes: H01L 2224/039 : Methods of manufacturing bonding areas involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/03901 : with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/0391 : Forming a passivation layer after forming the bonding area
• CPC Class Codes: H01L 2224/04105 : Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/05022 : the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/051 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/052 - H01L2224/05291
• CPC Class Codes: H01L 2224/05547 : comprising a core and a coating
• CPC Class Codes: H01L 2224/05567 : the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05573 : Single external layer
• CPC Class Codes: H01L 2224/05582 : Two-layer coating
• CPC Class Codes: H01L 2224/056 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05794 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/057 - H01L2224/05791
• CPC Class Codes: H01L 2224/05839 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05844 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05847 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05855 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/0603 : Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06102 : the bonding areas being at different heights
• CPC Class Codes: H01L 2224/10145 : Flow barriers
• CPC Class Codes: H01L 2224/11001 : Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/11005 : for aligning the bump connector, e.g. marks, spacers
• CPC Class Codes: H01L 2224/11009 : for protecting parts during manufacture
• CPC Class Codes: H01L 2224/111 : Manufacture and pre-treatment of the bump connector preform
• CPC Class Codes: H01L 2224/11318 : by dispensing droplets
• CPC Class Codes: H01L 2224/1132 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/1134 : Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/11848 : Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/119 : Methods of manufacturing bump connectors involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/11901 : with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/1191 : Forming a passivation layer after forming the bump connector
• CPC Class Codes: H01L 2224/13005 : Structure
• CPC Class Codes: H01L 2224/13017 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13018 : comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13021 : the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/13022 : the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13082 : Two-layer arrangements
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13116 : Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13169 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/1319 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291
• CPC Class Codes: H01L 2224/133 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13339 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13344 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13347 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13355 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13561 : On the entire surface of the core, i.e. integral coating
• CPC Class Codes: H01L 2224/13562 : On the entire exposed surface of the core
• CPC Class Codes: H01L 2224/13565 : Only outside the bonding interface of the bump connector
• CPC Class Codes: H01L 2224/136 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13609 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13611 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/1403 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/16058 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/16059 : comprising protrusions or indentations
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/16147 : the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16148 : the bump connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1701 : Structure
• CPC Class Codes: H01L 2224/1703 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/17505 : Bump connectors having different materials
• CPC Class Codes: H01L 2224/2101 : Structure
• CPC Class Codes: H01L 2224/211 : Disposition
• CPC Class Codes: H01L 2224/2401 : Structure
• CPC Class Codes: H01L 2224/2402 : Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24137 : the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24146 : the HDI interconnect connecting to the same level of the lower semiconductor or solid-state body at which the upper semiconductor or solid-state body is mounted
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 : the bodies being stacked
• CPC Class Codes: H01L 2224/73104 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73267 : Layer and HDI connectors
• CPC Class Codes: H01L 2224/75253 : adapted for localised heating
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81138 : the guiding structures being at least partially left in the finished device
• CPC Class Codes: H01L 2224/81141 : Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/8121 : using a reflow oven
• CPC Class Codes: H01L 2224/8122 : with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/82005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/82101 : by additive methods, e.g. direct writing
• CPC Class Codes: H01L 2224/82102 : using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/82105 : by using a preform
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/1023 : the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 : Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/98 : Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H01L 2924/381 : Pitch distance
• CPC Class Codes: H01L 2924/3841 : Solder bridging

Abstract

A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

Claims

1. A manufacture comprising:

a first structure comprising one or more contact pads;

one or more electrically conductive connections each of which has a bottom attached to at least one contact pad and comprises solder; and

a first layer comprising a top surface and one or more through-holes in the top surface, each through-hole'"'"'s sidewall being a dielectric sidewall, each through-hole containing at least a segment of a corresponding electrically conductive connection, the segment physically contacting the through-hole'"'"'s dielectric sidewall, the electrically conductive connection being recessed in the through-hole at the top of the through-hole;

wherein the first layer comprises;

a first dielectric sub-layer comprising, at each electrically conductive connection, an upward protrusion protruding above the first structure and laterally surrounding and physically contacting the electrically conductive connection; and

a second dielectric sub-layer overlaying the first dielectric sub-layer, the second dielectric sub-layer laterally surrounding each upward protrusion, the second dielectric sub-layer being a different material than the first dielectric sub-layer;

wherein each electrically conductive connection physically contacts the first dielectric sub-layer but not the second dielectric sub-layer; and

each electrically conductive connection and the first dielectric sub-layer are recessed in each through-hole.

2. The manufacture of claim 1 wherein at least one through-hole'"'"'s sidewall has a concave portion at the top of the through-hole, the concave portion being a portion of a sidewall of the first dielectric sub-layer.

3. The manufacture of claim 1 wherein at least one through-hole'"'"'s sidewall has a concave portion below the top of the through-hole and has a convex portion immediately above the concave portion.

4. The manufacture of claim 1 wherein in at least one plane cross-section extending along at least one through-hole, the through-hole'"'"'s sidewall is a straight line on each side of the through-hole.

5. The manufacture of claim 1 wherein at least one electrically conductive connection is attached to a non-solder conductive post of a second structure, the conductive post being partially located in a top portion of the corresponding through-hole.

6. The manufacture of claim 1 wherein each electrically conductive connection consists essentially of solder.

7. The manufacture of claim 1 wherein the first sub-layer is inorganic dielectric.

8. The manufacture of claim 1 wherein the one or more electrically conductive connections are a plurality of the electrically conductive connections, wherein at least two of the electrically conductive connections have different lengths.

9. The manufacture of claim 1 wherein the one or more electrically conductive connections are a plurality of the electrically conductive connections, wherein at least two of the electrically conductive connections have different heights in a view in which the electrically conductive connections are attached to one or more contact pads located at the same height.

10. The manufacture of claim 9 wherein the height-to-pitch ratio of the at least two of the electrically conductive connections is greater than 1.5.

11. The manufacture of claim 9 wherein the height-to-pitch ratio of the at least two of the electrically conductive connections is greater than 2.