Solid state lighting component

• US 9,793,247 B2
• Filed: 06/05/2008
• Issued: 10/17/2017
• Est. Priority Date: 01/10/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated, Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.), CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Yuan, Thomas, Keller, Bernd, Tarsa, Eric, Ibbetson, James, Morgan, Frederick, Dowling, Kevin, Lys, Ihor
• Primary Examiner(s): HO, HOANG QUAN TRAN
• Application Number:
  US12/156,995
• Publication Number:
  US 20090050908A1
• Time in Patent Office: 3,421 Days
• Field of Search: None
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05B 45/40 Details of LED load circuits

Abstract

An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

Claims

1. A monolithic light emitting diode (LED) package, comprising:

an LED array generating light having a luminous flux greater than 800 lumens at a color temperature less than 3000 K, said array on a submount;

patterned conductive features which connect said array to at least one bond pad, wherein said at least one bond pad is remote from said array;

at least one via through said submount which connects said at least one bond pad to a surface mount pad; and

a single lens coupled to said array, wherein a dead space between each LED is less than 0.50 mm, each LED in said LED array mounted on said patterned conductive features;

wherein a first path of said patterned conductive features electrically interconnects a first group of LEDs emitting at a first color temperature and a second path of said patterned conductive features electrically interconnects a second group of LEDs emitting at a second color temperature different than said first color temperature such that said first and second groups are independently controllable, and wherein said LED array is configured to shape an output beam of the LED package.

2. A monolithic light emitting diode (LED) package, comprising a carrier and an LED array capable of emitting light while being driven by a current of less than approximately 150 milli-Amps;

wherein said LED array is mounted on patterned conductive features on the carrier, said patterned conductive features connecting at least a portion of said array to at least one bond pad, wherein said at least one bond pad is remote from said LED array, said package comprising at least one via through said carrier which connects said at least one bond pad to a surface mount pad, a first path of said patterned conductive features electrically interconnecting a first group of LEDs emitting at a first color temperature and a second path of said patterned conductive features electrically interconnecting a second group of LEDs emitting at a second color temperature such that said first and second groups are independently controllable, and wherein said LED array is configured on the carrier to shape an output beam of the LED package.

3. The LED package of claim 2, wherein said LED array is capable of being driven by a current in the range of approximately 50 milli-Amps to less than approximately 150 milli-Amps.

4. A monolithic light emitting diode (LED) package, comprising an array of LED chips on a submount, under a single hemispheric lens having a dimension being approximately the same as or larger than the width of said array, in a substantially non-rectangular layout;

a heat spreading layer internal to said submount, wherein said heat spreading layer is electrically isolated from said array of LED chips; and

at least one bond pad on said submount and external to said single hemispheric lens;

wherein the focal point of said lens is below a horizontal plane approximated by the emitting regions of said LED chips, and wherein said array of LED chips shapes an output beam of the LED package.

5. The LED package of claim 4, wherein said LED chips have a size of less than 500 microns.

6. The LED package of claim 4, wherein said lens comprises a large diameter.

7. The LED package of claim 4, wherein said LED chips are mounted on a substrate comprising FR4 board.

8. A monolithic light emitting diode (LED) package, comprising an array of LED chips on a submount and under a single hemispheric lens in an asymmetric layout, wherein the focal point of said lens is below a horizontal plane approximated by the emitting regions of said LED chips, and wherein said array of LED chips is configured to shape an output beam of the LED package;

a heat spreading layer internal to said submount and electrically isolated from said array of LED chips; and

at least one bond pad on said submount and external to said single hemispheric lens.

9. A monolithic light emitting diode (LED) package, comprising:

an array of LED chips on a submount;

patterned conductive features which connect said array to at least one bond pad, wherein said at least one bond pad is remote from said array, wherein each of said LED chips emits light at a first or second color, said LED chips emitting at said first color randomly on said submount in relation to said LED chips emitting at said second color, said array of LED chips under a single hemispheric lens; and

at least one via through said submount which connects said at least one bond pad to a surface mount pad;

wherein a first serial circuit comprises said LED chips emitting at said first color and a second serial circuit comprises said LED chips emitting at said second color, and wherein said array of LED chips is configured to shape an output beam of the LED package.