Technique for the growth and fabrication of semipolar (Ga,Al,In,B)N thin films, heterostructures, and devices

• US 9,793,435 B2
• Filed: 11/30/2015
• Issued: 10/17/2017
• Est. Priority Date: 05/10/2004
• Status: Active Grant

• Current Assignee: Japan Science & Technology Trading Co. Limited, Regents of the University of California (University of California)
• Original Assignee: Japan Science & Technology Trading Co. Limited, Regents of the University of California (University of California)
• Inventors: Farrell, Jr., Robert M., Baker, Troy J., Chakraborty, Arpan, Haskell, Benjamin A., Pattison, P. Morgan, Sharma, Rajat, Mishra, Umesh K., DenBaars, Steven P., Speck, James S., Nakamura, Shuji
• Primary Examiner(s): Fan, Michelle
• Application Number:
  US14/953,858
• Publication Number:
  US 20160079738A1
• Time in Patent Office: 687 Days
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: C30B 23/025 characterised by the substrate
• CPC Class Codes: C30B 25/18 characterised by the substrate
• CPC Class Codes: C30B 29/403 AIII-nitrides
• CPC Class Codes: H01L 21/02389 Nitrides
• CPC Class Codes: H01L 21/0242 Crystalline insulating materials
• CPC Class Codes: H01L 21/02433 Crystal orientation
• CPC Class Codes: H01L 21/02458 Nitrides
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02609 Crystal orientation
• CPC Class Codes: H01L 33/0004 Devices characterised by their operation
• CPC Class Codes: H01L 33/0062 for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/02 characterised by the semiconductor bodies
• CPC Class Codes: H01L 33/16 with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
• CPC Class Codes: H01S 2304/04 MOCVD or MOVPE
• CPC Class Codes: H01S 5/0422 with n- and p-contacts on the same side of the active layer
• CPC Class Codes: H01S 5/04257 having positive and negative electrodes on the same side of the substrate
• CPC Class Codes: H01S 5/2201 in a specific crystallographic orientation
• CPC Class Codes: H01S 5/320275 semi-polar orientation
• CPC Class Codes: H01S 5/34333 : with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser

Abstract

A method for growth and fabrication of semipolar (Ga,Al,In,B)N thin films, heterostructures, and devices, comprising identifying desired material properties for a particular device application, selecting a semipolar growth orientation based on the desired material properties, selecting a suitable substrate for growth of the selected semipolar growth orientation, growing a planar semipolar (Ga,Al,In,B)N template or nucleation layer on the substrate, and growing the semipolar (Ga,Al,In,B)N thin films, heterostructures or devices on the planar semipolar (Ga,Al,In,B)N template or nucleation layer. The method results in a large area of the semipolar (Ga,Al,In,B)N thin films, heterostructures, and devices being parallel to the substrate surface.

Claims

1. A light emitting device configured as a laser device, comprising:

a semipolar III-nitride film including a light emitting device structure, wherein;

the light emitting device structure includes a diode structure including a semipolar III-nitride active layer, the diode structure having a current-voltage (I-V) characteristic,

material properties of the semipolar III-nitride active layer are such that the device emits light in response to a drive current density of 278 Amps per centimeter square,

the material properties are effective to achieve the I-V characteristic exhibiting a turn-on voltage of at most 3.1 Volts, and

the drive current density is direct current density; and

an edge configured on the light emitting device structure for emission of light.

2. The device of claim 1, wherein the material properties are effective to obtain light emission having output power increasing linearly as the drive current density is increased from 33 Amps per centimeter square to 222 Amps per centimeter square.

3. The device of claim 1, wherein the material properties are such that the device emits light having an output power of at least 1.5 milliwatts at the drive current density.

4. The device of claim 1, wherein the semipolar III-nitride active layer emits light with a reduced decrease in the external quantum efficiency (EQE) with increasing drive current density, as compared to a polar III-nitride active layer operating in similar wavelength and drive current density ranges.

5. The device of claim 1, wherein the semipolar III-nitride active layer has reduced polarization effects and effective hole masses, as compared to a polar III-nitride active layer operating in similar wavelength and drive current density ranges.

6. The device of claim 1, wherein:

the semipolar III-nitride active layer is grown on or above a substrate, and

a top surface of the semipolar III-nitride active layer is planar, semipolar, and substantially parallel to a main surface of the substrate.

7. The device of claim 1, wherein the semipolar III-nitride active layer is grown on or above a Gallium Nitride substrate.

8. The device of claim 1, wherein the semipolar III-nitride active layer is grown on or above Gallium Nitride having a thickness of at least 10 micrometers.

9. The device of claim 8, wherein the semipolar III-nitride active layer is grown on or above a top surface of the Gallium Nitride and the top surface has a {1011}, {1013}, or {1122} orientation.

10. The device of claim 8, wherein:

the semipolar III-nitride active layer is grown on or above a top surface of the Gallium Nitride, and

the top surface is oriented at a crystal angle θ

from a c-plane of the Gallium Nitride and 58.4°

≦

θ

<

90°

.

11. The device of claim 1, wherein the device is a laser diode emitting blue light.

12. A light emitting device configured as a laser device, comprising:

a semipolar III-nitride film including a light emitting device structure, wherein;

the light emitting device structure includes a semipolar III-nitride active layer,

material properties of the semipolar III-nitride active layer are such that the device emits light in response to a drive current density of 278 Amps per centimeter square,

the material properties are effective to obtain the device that does not exhibit heating effects or saturation as the drive current density is increased from 33 Amps per centimeter square to 222 Amps per centimeter square, and

the drive current density is direct current density; and

an edge configured on the light emitting device structure for emission of light.

13. The device of claim 12, wherein the semipolar III-nitride active layer is grown on or above a Gallium Nitride substrate.

14. The device of claim 12, wherein the semipolar III-nitride active layer is grown on or above a top surface of Gallium Nitride having a thickness of at least 10 micrometers.

15. The device of claim 14, wherein the top surface is oriented at a crystal angle θ

from a c-plane of the Gallium Nitride and 58.4°

≦

θ

<

90°

.

16. The device of claim 12, wherein the device is a laser diode emitting blue light.

17. A light emitting device configured as a laser device, comprising:

a semipolar III-nitride film including a light emitting device structure, wherein;

the light emitting device structure includes a semipolar III-nitride active layer,

material properties of the semipolar III-nitride active layer are such that the device emits light in response to a drive current density of 278 Amps per centimeter square,

the semipolar III-nitride active layer emits the light with reduced blue-shift in a blue emission peak when increasing the drive current density between 33 Amps per centimeter square and 222 Amps per centimeter square, as compared to a polar III-nitride active layer operating in similar wavelength and drive current density ranges, and

the drive current density is direct current density; and

an edge configured on the light emitting device structure for emission of light.

18. The device of claim 17, wherein the semipolar III-nitride active layer is grown on or above a Gallium Nitride substrate.

19. The device of claim 17, wherein the semipolar III-nitride active layer is grown on or above a top surface of Gallium Nitride having a thickness of at least 10 micrometers.

20. The device of claim 19, wherein the top surface is oriented at a crystal angle θ

from a c-plane of the Gallium Nitride and 58.4°

≦

θ

<

90°

.