Light-emitting diode device

• US 9,793,451 B2
• Filed: 11/25/2014
• Issued: 10/17/2017
• Est. Priority Date: 10/26/2011
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Hsu, Chia-Liang, Wu, Han-Min, Hsu, Ye-Ming, Huang, Chien-Fu, Hsu, Tzu-Chieh, Hsieh, Min-Hsun
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): INOUSSA, MOULOUCOULAY
• Application Number:
  US14/553,513
• Publication Number:
  US 20150084086A1
• Time in Patent Office: 1,057 Days
• Field of Search: 257 98, 257E33067, 257E33074, 257 79, 257 99, 257103, 257E33066, 257E33013, 257E33005, 257E21218, 438 43, 438 22
• CPC Class Codes: G02B 6/0025 Diffusing sheet or layer; Prismatic sheet or layer
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

Claims

1. An encapsulated light-emitting diode device, comprising:

a circuit carrier comprising a surface; and

a light-emitting device, comprising;

a transparent substrate comprising a first surface not parallel to the surface of the circuit carrier, and a second surface opposite to the first surface;

a light-emitting diode chip comprising a bottommost surface facing and fully overlapping the first surface, and an electrode which is spatially opposite to the bottommost surface and electrically connected to the circuit carrier; and

a first transparent glue covering the light-emitting diode chip and the first surface without directly contacting the circuit carrier, and having a first curved line and a second curved line farther from the circuit carrier than the first curve line in a cross sectional view; and

a second transparent glue formed on the second surface in a position corresponding to the first transparent glue.

2. The encapsulated light-emitting device as claimed in claim 1, wherein the first surface and the surface of the circuit carrier form an included angle between 45 degrees to 135 degrees.

3. The encapsulated light-emitting device as claimed in claim 1, further comprising a first fixing glue forming on the first surface and surrounding the periphery of the first transparent glue.

4. The encapsulated light-emitting device as claimed in claim 3, further comprising a second fixing glue forming on the second surface and surrounding the periphery of the second transparent glue.

5. The encapsulated light-emitting device as claimed in claim 3, wherein the first fixing glue is a reflective white glue.

6. The encapsulated light-emitting device as claimed in claim 1, wherein the circuit carrier is a printed circuit board (PCB), a flexible circuit board (FCB), a ceramic substrate, or a composite substrate.

7. The encapsulated light-emitting device as claimed in claim 1, further comprising a phosphor layer covering the light-emitting diode chip.

8. The encapsulated light-emitting device as claimed in claim 1, wherein the first transparent glue has phosphor particles therein or thereon.

9. The encapsulated light-emitting device as claimed in claim 1, further comprising an adhesive layer adhering the transparent substrate to the surface of the carrier.

10. The encapsulated light-emitting device as claimed in claim 1, wherein the material of the first transparent glue and the second transparent glue comprises polyimide, BCB, PFCB, SU8, epoxy, Acrylic Resin, COC, PMMA, PET, PC, polyetherimide, fluorocarbon polymer, SOG, or other transparent organic material.

11. The encapsulated light-emitting device as claimed in claim 1, the light-emitting diode chip further comprises a front light extraction surface substantially perpendicular to the surface.

12. The encapsulated light-emitting device as claimed in claim 1, wherein the first transparent glue and the second transparent glue are dome shapes or substantially hemispheric shapes.

13. The encapsulated light-emitting device as claimed in claim 12, wherein the first transparent glue and the second transparent glue substantially form a sphere.

14. The encapsulated light-emitting device as claimed in claim 1, wherein light extracted from the encapsulated light-emitting device is substantially an omnidirectional light source.

15. The encapsulated light-emitting device as claimed in claim 1, wherein the first transparent glue and the second transparent glue are symmetrical with respect to the transparent substrate.

16. The encapsulated light-emitting device as claimed in claim 1, further comprising an electrical connection electrically connecting the electrode and a circuit arranged on the circuit carrier.

17. The encapsulated light-emitting device as claimed in claim 1, wherein the first transparent glue contacts with the light-emitting diode chip.

18. The encapsulated light-emitting device as claimed in claim 1, wherein the first fixing glue is formed between the first surface and the first transparent glue, and fixes the first transparent glue to be a nearly hemispheric form with the circular projection.

19. The encapsulated light-emitting device as claimed in claim 1, wherein the light-emitting diode chip comprises a first bottom surface facing to the first surface.

20. The encapsulated light-emitting device as claimed in claim 1, wherein the second transparent glue has a third curved line and a fourth curved line farther from the circuit carrier than the third curved line in the cross sectional view.