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Light-emitting device and method of manufacturing thereof

  • US 9,793,458 B2
  • Filed: 02/21/2017
  • Issued: 10/17/2017
  • Est. Priority Date: 07/05/2013
  • Status: Active Grant
First Claim
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1. A method of manufacturing a light-emitting device, which comprises:

  • providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; and

    conducting a first separating step comprises;

    providing a second substrate;

    conducting a first bonding step to bond the first semiconductor stacked block to the second substrate;

    separating the first semiconductor stacked block from the first substrate and keeping a second semiconductor stacked block on the first substrate; and

    conducting a second bonding step to bond and align the first semiconductor stacked block with the second semiconductor stacked block.

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