Method of manufacturing a circuit device

• US 9,793,826 B2
• Filed: 01/22/2016
• Issued: 10/17/2017
• Est. Priority Date: 09/24/2010
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Mashimo, Shigeaki, Horiuchi, Fumio, Kudo, Kiyoaki, Sakurai, Akira, Inagaki, Yuhki
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US15/003,958
• Publication Number:
  US 20160211247A1
• Time in Patent Office: 634 Days
• Field of Search: 438107, 438 15, 438125, 257177, 257676, 257691, 361772, 363 2104, 29837
• CPC Class Codes: H01L 21/4825 Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48096 the kinked part being in proximity to the bonding area on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H02M 7/537 : using semiconductor devices only, e.g. single switched pulse inverters
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: Y10T 29/4916 : Simultaneous circuit manufacturing

Abstract

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

Claims

1. A method of manufacturing a circuit device, comprising:

providing a lead frame comprising a plurality of leads, each of the leads comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion,

mounting circuit elements on upper surfaces of the island portions;

connecting the circuit elements to corresponding bonding portions by wirings wherein one of the plurality of leads is a first input lead, another of the plurality of leads is a second input lead, and yet another of the plurality of leads is an output lead for outputting alternating-current power obtained by converting direct-current power inputted through the first input lead and the second input lead;

attaching lower surfaces of the island portions to an upper surface of a circuit board;

encapsulating by a resin the circuit board, the circuit elements and the lead frame so that the lead portions are not covered by the resin;

connecting the first input lead to a positive electrode of a direct-current power source; and

connecting the second input lead to a negative electrode side of the direct-current power source.

2. The method of claim 1, wherein a first circuit element of the circuit elements mounted on an island portion of a first lead of the leads and a bonding portion of a second lead of the leads are electrically connected through a first wiring.

3. The method of claim 2, wherein there is no other lead between the first lead and the second lead.

4. The method of claim 2, wherein there is a third lead between the first lead and the second lead, and the first wiring passes above the third lead.

5. The method of claim 1, wherein mounting circuit elements on upper surfaces of the island portions comprises:

mounting a diode on an upper surface of the island portion of a first lead; and

mounting a transistor on the upper surface of the island portion of the first lead.

6. The method of claim 5, wherein mounting the transistor on the upper surface of the island portion of the first lead further comprises:

mounting an insulated gate bipolar transistor on the upper surface of the island portion of the first lead.

7. The method of claim 6, further comprising:

mounting an insulative control board on the upper surface of the circuit board; and

mounting a control element on an upper surface of the insulative control board.

8. The method of claim 7, further comprising:

connecting the control element to at least one of the circuit elements through at least one wiring.

9. The method of claim 8, wherein connecting the control element to the at least one of the circuit elements through the at least one wiring comprises:

connecting the control element to the transistor through the at least one wiring.

10. The method of claim 1, further comprising:

mounting an insulative control board on the upper surface of the circuit board; and

mounting a control element on an upper surface of the insulative control board.

11. The method of claim 10, further comprising:

connecting the control element to at least one of the circuit elements through at least one wiring.