Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package

• US 9,794,661 B2
• Filed: 08/07/2015
• Issued: 10/17/2017
• Est. Priority Date: 08/07/2015
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Watson, Joshua, Grosse, Daniel Todd, Jacobs, Michael Robert, Schimpf, William F., Del Valle Figueroa, Ivelisse
• Primary Examiner(s): Etesam, Amir
• Application Number:
  US14/821,303
• Publication Number:
  US 20170041692A1
• Time in Patent Office: 802 Days
• Field of Search: 381175
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H04R 1/023 Screens for loudspeakers
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 17/02 Microphones
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use

Abstract

A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.

Claims

1. A micro-electro-mechanical system (MEMS) microphone, the microphone comprising:

a substrate comprising;

a base layer that has a top surface and a bottom surface;

a first plurality of metal pads disposed on the top surface of the base;

a second plurality of metal pads disposed on the bottom surface of the base layer; and

one or more electrical pathways disposed within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer;

a MEMS microphone die mounted to the top surface of the substrate and electrically coupled to at least one of the first plurality of metal pads on the top surface of the substrate, wherein the MEMS microphone die comprises a backplate and a diaphragm; and

a cover formed from a solid material that comprises a top portion and a sidewall portion that adjoins the top portion at an angle and that surrounds and supports the top portion, wherein;

an acoustic port is disposed in the top portion of the cover and passes through the cover;

the sidewall portion of the cover is attached to the top surface of the substrate to define an acoustic chamber for the MEMS microphone die;

the cover further comprises an ingress protection element attached to the interior surface of the cover and disposed inside the acoustic chamber; and

the ingress protection element is a three-sided cup-shaped shield, wherein the open end of the shield is disposed away from the MEMS microphone die, wherein the three-sided shield is configured to reduce contaminant intrusion into the acoustic chamber.

6. A MEMS microphone according to claim 1, further comprising an application-specific integrated circuit (ASIC) die disposed within the acoustic chamber, wherein a portion of the three-sided cup-shaped shield adjacent to the ASIC die is open to allow acoustic pressure to reach the MEMS microphone die.

7. A MEMS microphone according to claim 1, further comprising a step offset member extending from the cover to the acoustic chamber, wherein the step offset member surrounds the acoustic port.

8. A MEMS microphone according to claim 7, wherein the step offset member touches an interior surface of the three-sided cup-shaped shield.

9. A MEMS microphone according to claim 7, wherein there is a gap between the step offset member and an interior surface of the three-sided cup-shaped shield.

10. A MEMS microphone according to claim 1, wherein the three-sided cup-shaped shield is constructed from a metal, a plastic, or a polymer.

11. A MEMS microphone according to claim 1, wherein the second plurality of metal pads comprises terminal pads configured to connect to an end-user printed circuit board.

12. A MEMS microphone according to claim 1, wherein the second plurality of metal pads comprises ground rings configured to connect to a ground plane.

13. A MEMS microphone according to claim 1, wherein the second plurality of metal pads comprises a seal ring configured to seal an acoustic pathway between the MEMS microphone and an end-user printed circuit board coupled to the MEMS microphone.

14. A MEMS microphone according to claim 1, wherein the first plurality of metal pads comprises an attachment ring surrounding an interior region of the substrate for reducing electromagnetic interference.

15. A MEMS microphone according to claim 1, wherein the first plurality of metal pads comprises a retaining ring adjacent to the MEMS microphone die for preventing wicking of a die attach epoxy into the MEMS microphone die.

17. A MEMS microphone according to claim 1, wherein the second plurality of metal pads comprises terminal pads configured to connect to an end-user printed circuit board and ground rings configured to connect to a ground plane.

19. A MEMS microphone according to claim 1, wherein the first plurality of metal pads comprises an attachment ring surrounding an interior region of the substrate for reducing electromagnetic interference.

2. A micro-electro-mechanical system (MEMS) microphone, the microphone comprising:

a substrate comprising;

a base layer that has a top surface and a bottom surface;

a first plurality of metal pads disposed on the top surface of the base;

a second plurality of metal pads disposed on the bottom surface of the base layer; and

one or more electrical pathways disposed within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer;

a MEMS microphone die mounted to the top surface of the substrate and electrically coupled to at least one of the first plurality of metal pads on the top surface of the substrate, wherein the MEMS microphone die comprises a backplate and a diaphragm; and

a cover formed from a solid material that comprises a top portion and a sidewall portion that adjoins the top portion at an angle and that surrounds and supports the top portion, wherein;

an acoustic port is disposed in the top portion of the cover and passes through the cover;

the sidewall portion of the cover is attached to the top surface of the substrate to define an acoustic chamber for the MEMS microphone die;

the cover further comprises an ingress protection element attached to the interior surface of the cover and disposed inside the acoustic chamber; and

the ingress protection element is a four-sided cup-shaped shield that comprises a shield aperture, wherein the shield aperture is disposed away from the MEMS microphone die, wherein the full shield is configured to reduce contaminant intrusion into the acoustic chamber.

3. A MEMS microphone according to claim 2, wherein the shield aperture comprises a plurality of shield apertures arranged in a row.

4. A MEMS microphone according to claim 2, wherein the shield aperture comprises a plurality of shield apertures arranged in a matrix.

5. A MEMS microphone according to claim 2, wherein the shield aperture comprises a plurality of shield apertures having passages oriented in non-perpendicular arrangement with respect to the surface of the four-sided cup-shaped shield.

16. A MEMS microphone according to claim 2, wherein the four-sided cup-shaped shield is constructed from a metal, a plastic, or a polymer.

18. A MEMS microphone according to claim 2, wherein the second plurality of metal pads comprises a seal ring configured to seal an acoustic pathway between the MEMS microphone and an end-user printed circuit board coupled to the MEMS microphone.

20. A MEMS microphone according to claim 2, wherein the first plurality of metal pads comprises a retaining ring adjacent to the MEMS microphone die for preventing wicking of a die attach epoxy into the MEMS microphone die.